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XCZU4EG-1FBVB900E

XCZU4EG-1FBVB900E

Manufacturer No:

XCZU4EG-1FBVB900E

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 900FCBGA

Datasheet:

Datasheet

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XCZU4EG-1FBVB900E Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
  • Speed
    500MHz, 600MHz, 1.2GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EG
The DG300A/BIA integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: These chips are designed to operate with low power requirements, making them suitable for battery-powered devices and energy-efficient applications. 2. High integration: The DG300A/BIA chips integrate multiple functions into a single chip, reducing the need for external components and simplifying the overall circuit design. 3. Small form factor: The chips are available in compact packages, making them suitable for space-constrained applications. 4. Wide operating voltage range: These chips can operate over a wide range of voltage levels, providing flexibility in various power supply scenarios. 5. High reliability: The chips are designed to offer high reliability and robustness, ensuring stable performance even in challenging environments.Application scenarios: 1. Portable devices: The low power consumption and small form factor of DG300A/BIA chips make them suitable for use in portable devices such as smartphones, tablets, and wearable devices. 2. Internet of Things (IoT): These chips can be used in IoT devices that require low power consumption and compact size, such as smart home devices, sensors, and connected appliances. 3. Industrial automation: The high reliability and wide operating voltage range of these chips make them suitable for industrial automation applications, including control systems, motor drives, and power management. 4. Consumer electronics: DG300A/BIA chips can be used in various consumer electronics applications, including audio/video equipment, gaming consoles, and remote controls. 5. Automotive electronics: These chips can be utilized in automotive electronics for functions such as power management, control systems, and infotainment systems.Overall, the DG300A/BIA integrated circuit chips offer advantages in terms of power consumption, integration, size, and reliability, making them suitable for a wide range of applications in different industries.
XCZU4EG-1FBVB900E Relevant information