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XAZU3EG-1SFVA625I

XAZU3EG-1SFVA625I

Manufacturer No:

XAZU3EG-1SFVA625I

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 625FCBGA

Datasheet:

Datasheet

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XAZU3EG-1SFVA625I Specifications

  • Type
    Parameter
  • Supplier Device Package
    625-FCBGA (21x21)
  • Package / Case
    625-BFBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
  • Speed
    500MHz, 1.2GHz
  • Connectivity
    CANbus, I²C, SPI, UART/USART, USB
  • Peripherals
    DMA, WDT
  • RAM Size
    1.8MB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MPU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EG
The MAX350EAP+ is a high-speed, low-power, precision operational amplifier integrated circuit chip. Some of its advantages and application scenarios include:Advantages: 1. High Speed: The MAX350EAP+ offers a high slew rate and bandwidth, making it suitable for applications that require fast response times. 2. Low Power Consumption: It operates at low power supply voltages and consumes minimal power, making it ideal for battery-powered devices or applications where power efficiency is crucial. 3. Precision: The chip provides high precision and accuracy in amplification, ensuring reliable and accurate signal processing. 4. Wide Supply Voltage Range: It can operate over a wide range of supply voltages, allowing flexibility in various applications. 5. Small Package: The MAX350EAP+ is available in a small package, making it suitable for space-constrained designs.Application Scenarios: 1. Audio Amplification: The high-speed and precision characteristics of the MAX350EAP+ make it suitable for audio amplification applications, such as in audio systems, headphones, or portable speakers. 2. Instrumentation Amplifiers: It can be used in precision instrumentation amplifiers for accurate measurement and signal conditioning in fields like industrial automation, medical devices, or scientific instruments. 3. Data Acquisition Systems: The chip's high-speed capabilities make it suitable for data acquisition systems that require fast and accurate signal processing, such as in data loggers or control systems. 4. Communication Systems: The MAX350EAP+ can be used in communication systems that require high-speed amplification, such as in wireless transceivers or base stations. 5. Sensor Signal Conditioning: It can be utilized in sensor signal conditioning circuits to amplify and process weak sensor signals accurately, enabling precise measurements in applications like temperature sensing or pressure monitoring.These are just a few examples of the advantages and application scenarios of the MAX350EAP+ integrated circuit chips. The versatility and performance of the chip make it suitable for a wide range of applications where high-speed, low-power, and precision amplification is required.
XAZU3EG-1SFVA625I Relevant information