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XCZU3EG-1SFVA625I

XCZU3EG-1SFVA625I

Manufacturer No:

XCZU3EG-1SFVA625I

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 625FCBGA

Datasheet:

Datasheet

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XCZU3EG-1SFVA625I Specifications

  • Type
    Parameter
  • Supplier Device Package
    625-FCBGA (21x21)
  • Package / Case
    625-BFBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
  • Speed
    500MHz, 600MHz, 1.2GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EG
The MAX352ESE+ is a high-speed, low-power, and low-distortion integrated circuit (IC) chip designed for use in communication systems. Some of the advantages and application scenarios of the MAX352ESE+ are:1. High-speed operation: The MAX352ESE+ supports data rates up to 2.5Gbps, making it suitable for high-speed communication applications such as fiber-optic networks, high-speed data transmission, and high-speed serial links.2. Low power consumption: The IC chip is designed to operate with low power consumption, making it suitable for battery-powered devices and energy-efficient systems.3. Low distortion: The MAX352ESE+ offers low distortion characteristics, ensuring high-quality signal transmission and reception. This makes it suitable for applications where signal integrity is crucial, such as high-speed data communication and video transmission.4. Wide operating voltage range: The IC chip operates over a wide voltage range, typically from 3.0V to 3.6V, allowing for flexibility in system design and compatibility with various power supply configurations.5. Small form factor: The MAX352ESE+ is available in a small 16-pin narrow SOIC package, making it suitable for space-constrained applications and compact system designs.Application scenarios of the MAX352ESE+ include:1. Fiber-optic communication systems: The high-speed and low-distortion characteristics of the MAX352ESE+ make it suitable for use in fiber-optic transceivers, enabling high-speed data transmission over long distances.2. High-speed data communication: The IC chip can be used in high-speed data communication systems, such as Ethernet switches, routers, and data centers, to ensure reliable and high-quality data transmission.3. Video transmission: The low distortion and high-speed capabilities of the MAX352ESE+ make it suitable for video transmission applications, such as video surveillance systems, video conferencing, and high-definition video streaming.4. Wireless communication systems: The IC chip can be used in wireless communication systems, such as wireless base stations and access points, to handle high-speed data transmission and ensure low distortion in the signal chain.5. Test and measurement equipment: The MAX352ESE+ can be used in test and measurement equipment, such as oscilloscopes and signal analyzers, to capture and analyze high-speed signals accurately.Overall, the MAX352ESE+ integrated circuit chip offers high-speed, low-power, and low-distortion capabilities, making it suitable for a wide range of communication applications that require reliable and high-quality signal transmission.
XCZU3EG-1SFVA625I Relevant information