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XCZU1CG-L1SFVA625I

XCZU1CG-L1SFVA625I

Manufacturer No:

XCZU1CG-L1SFVA625I

Manufacturer:

AMD

Description:

IC ZUP MPSOC LP A53 FPGA 625BGA

Datasheet:

Datasheet

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XCZU1CG-L1SFVA625I Specifications

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    Parameter
  • Connectivity
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  • RAM Size
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  • Packaging
    Tray
The 1SX280LN3F43E2VGS2 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with low power consumption, making them suitable for various applications. 2. Compact Size: The chips are compact in size, allowing for easy integration into different electronic devices and systems. 3. Versatility: They offer versatile functionality, making them suitable for a wide range of applications. 4. Reliability: These chips are designed to be highly reliable, ensuring stable and consistent performance over time. 5. Cost-Effective: The chips offer a cost-effective solution for various electronic applications.Application Scenarios: 1. Consumer Electronics: These chips can be used in various consumer electronic devices such as smartphones, tablets, smartwatches, and portable media players. 2. Internet of Things (IoT): The chips can be utilized in IoT devices like smart home appliances, wearable devices, and industrial sensors. 3. Automotive: They can be used in automotive applications such as advanced driver-assistance systems (ADAS), infotainment systems, and engine control units. 4. Industrial Automation: These chips can be employed in industrial automation systems for control and monitoring purposes. 5. Communication Systems: They can be used in communication systems like routers, switches, and network equipment.Overall, the 1SX280LN3F43E2VGS2 integrated circuit chips offer high performance, versatility, and reliability, making them suitable for a wide range of applications in various industries.
XCZU1CG-L1SFVA625I Relevant information