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M2S010TS-1FGG484

M2S010TS-1FGG484

Manufacturer No:

M2S010TS-1FGG484

Manufacturer:

Microchip Technology

Description:

IC SOC CORTEX-M3 166MHZ 484FBGA

Datasheet:

Datasheet

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M2S010TS-1FGG484 Specifications

  • Type
    Parameter
  • Supplier Device Package
    484-FPBGA (23x23)
  • Package / Case
    484-BGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Primary Attributes
    FPGA - 10K Logic Modules
  • Speed
    166MHz
  • Connectivity
    CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Peripherals
    DDR, PCIe, SERDES
  • RAM Size
    64KB
  • Flash Size
    256KB
  • Core Processor
    ARM® Cortex®-M3
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    SmartFusion®2
The R8A77210C133BGV is an integrated circuit chip developed by Renesas Electronics Corporation. It is a system-on-chip (SoC) designed for automotive applications. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The R8A77210C133BGV chip is built on a powerful ARM Cortex-A9 dual-core processor, providing high processing capabilities for demanding automotive applications. 2. Graphics Capabilities: It features a PowerVR SGX531 graphics engine, enabling advanced graphical user interfaces and supporting multimedia applications. 3. Connectivity: The chip supports various connectivity options, including Ethernet, USB, CAN, and LIN interfaces, allowing seamless integration with other automotive systems. 4. Safety and Reliability: It is designed to meet the stringent safety and reliability requirements of the automotive industry, ensuring stable and secure operation in harsh environments. 5. Low Power Consumption: The chip incorporates power-saving technologies, optimizing energy efficiency and reducing overall power consumption.Application Scenarios: 1. Infotainment Systems: The R8A77210C133BGV chip can be used in automotive infotainment systems, providing advanced multimedia capabilities, connectivity options, and support for various audio and video formats. 2. Advanced Driver Assistance Systems (ADAS): It can be utilized in ADAS applications, enabling real-time processing of sensor data, image recognition, and object detection for features like lane departure warning, collision avoidance, and adaptive cruise control. 3. Instrument Clusters: The chip can power instrument clusters, offering high-resolution graphics, customizable user interfaces, and seamless integration with vehicle sensors and systems. 4. Telematics: It can be employed in telematics systems, enabling vehicle tracking, remote diagnostics, over-the-air updates, and connectivity with external services. 5. Gateway Modules: The chip can serve as a gateway module, facilitating communication between different in-vehicle networks, such as CAN, LIN, and Ethernet, enabling data exchange and integration of various automotive systems.Overall, the R8A77210C133BGV chip provides a powerful and versatile solution for automotive applications, offering high performance, graphics capabilities, connectivity, and safety features.
M2S010TS-1FGG484 Relevant information