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M2S025-FCSG325

M2S025-FCSG325

Manufacturer No:

M2S025-FCSG325

Manufacturer:

Microchip Technology

Description:

IC SOC CORTEX-M3 166MHZ 325BGA

Datasheet:

Datasheet

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M2S025-FCSG325 Specifications

  • Type
    Parameter
  • Supplier Device Package
    325-FCBGA (11x11)
  • Package / Case
    325-TFBGA, FCBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Primary Attributes
    FPGA - 25K Logic Modules
  • Speed
    166MHz
  • Connectivity
    CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Peripherals
    DDR, PCIe, SERDES
  • RAM Size
    64KB
  • Flash Size
    256KB
  • Core Processor
    ARM® Cortex®-M3
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    SmartFusion®2
The MPC755CPX350LE is a specific model of integrated circuit chip manufactured by NXP Semiconductors. It belongs to the PowerPC family of microprocessors and is designed for embedded computing applications. Here are some advantages and application scenarios of the MPC755CPX350LE:Advantages: 1. High Performance: The MPC755CPX350LE chip offers a high clock speed and powerful processing capabilities, making it suitable for demanding applications that require fast and efficient computation.2. Power Efficiency: This chip is designed to be power-efficient, which is crucial for embedded systems that often operate on limited power sources or have strict power consumption requirements.3. Reliability: NXP Semiconductors is known for producing reliable and durable chips, ensuring the MPC755CPX350LE can withstand harsh operating conditions and provide long-term stability.4. Compatibility: The MPC755CPX350LE is compatible with various software and hardware platforms, making it easier to integrate into existing systems or develop new applications.Application Scenarios: 1. Industrial Automation: The high performance and reliability of the MPC755CPX350LE make it suitable for industrial automation applications, such as robotics, machine control, and process monitoring.2. Aerospace and Defense: The chip's power efficiency and compatibility make it suitable for aerospace and defense applications, including avionics systems, radar processing, and military-grade embedded computing.3. Medical Devices: The MPC755CPX350LE can be used in medical devices that require real-time processing, such as patient monitoring systems, medical imaging, and diagnostic equipment.4. Automotive: The chip's robustness and compatibility make it suitable for automotive applications, including advanced driver-assistance systems (ADAS), engine control units (ECUs), and infotainment systems.5. Networking and Telecommunications: The MPC755CPX350LE can be used in networking and telecommunications equipment, such as routers, switches, and base stations, to handle high-speed data processing and network management tasks.It's important to note that the specific application scenarios may vary depending on the requirements and customization of the embedded system.
M2S025-FCSG325 Relevant information