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M2S005S-FGG484I

M2S005S-FGG484I

Manufacturer No:

M2S005S-FGG484I

Manufacturer:

Microchip Technology

Description:

IC SOC CORTEX-M3 166MHZ 484FBGA

Datasheet:

Datasheet

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M2S005S-FGG484I Specifications

  • Type
    Parameter
  • Supplier Device Package
    484-FPBGA (23x23)
  • Package / Case
    484-BGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Primary Attributes
    FPGA - 5K Logic Modules
  • Speed
    166MHz
  • Connectivity
    CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Peripherals
    DDR
  • RAM Size
    64KB
  • Flash Size
    128KB
  • Core Processor
    ARM® Cortex®-M3
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    SmartFusion®2
The LX2160XN72029B integrated circuit (IC) chips, also known as the LX2160A, are high-performance multicore processors developed by NXP Semiconductors. These chips are part of the Layerscape family and are designed for various networking and data center applications. Here are some advantages and application scenarios of the LX2160XN72029B IC chips:Advantages: 1. High Performance: The LX2160XN72029B chips feature 16 ARM Cortex-A72 cores running at up to 2.2 GHz, providing significant processing power for demanding applications. 2. Scalability: These chips support up to 100 Gbps Ethernet connectivity, enabling high-speed data transfer and networking capabilities. 3. Power Efficiency: The LX2160XN72029B chips are designed with power efficiency in mind, allowing for reduced power consumption and heat generation. 4. Integrated Features: The chips include various integrated features such as hardware acceleration, virtualization support, and security features, enhancing overall system performance and security.Application Scenarios: 1. Networking Equipment: The LX2160XN72029B chips are commonly used in networking equipment such as routers, switches, and gateways. Their high-performance cores and Ethernet connectivity make them suitable for handling large amounts of network traffic. 2. Data Centers: These chips can be utilized in data center servers and storage systems. Their multicore architecture and high-speed connectivity enable efficient data processing and storage management. 3. Edge Computing: With their power efficiency and integrated features, the LX2160XN72029B chips can be deployed in edge computing devices. These devices bring computing capabilities closer to the data source, reducing latency and enabling real-time processing in applications like IoT and AI. 4. Network Function Virtualization (NFV): The chips' virtualization support and hardware acceleration make them suitable for NFV deployments. NFV allows network functions to be virtualized and run on standard hardware, and the LX2160XN72029B chips can provide the necessary performance and features for such applications.Overall, the LX2160XN72029B IC chips offer high performance, scalability, and power efficiency, making them suitable for various networking, data center, edge computing, and NFV applications.
M2S005S-FGG484I Relevant information