M2S005S-VFG256
Manufacturer No:
M2S005S-VFG256
Manufacturer:
Description:
IC SOC CORTEX-M3 166MHZ 256FBGA
Datasheet:
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In Stock : 0
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M2S005S-VFG256 Specifications
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TypeParameter
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Supplier Device Package256-FPBGA (17x17)
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Package / Case256-LBGA
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Operating Temperature0°C ~ 85°C (TJ)
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Primary AttributesFPGA - 5K Logic Modules
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Speed166MHz
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ConnectivityCANbus, Ethernet, I²C, SPI, UART/USART, USB
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Peripherals-
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RAM Size64KB
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Flash Size128KB
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Core ProcessorARM® Cortex®-M3
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ArchitectureMCU, FPGA
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PackagingTray
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Product StatusActive
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SeriesSmartFusion®2
The LS1012ASE7HKA557 is a specific model of the LS1012A family of integrated circuit chips developed by NXP Semiconductors. These chips are designed for various applications in the embedded systems and Internet of Things (IoT) domains. Here are some advantages and application scenarios of the LS1012ASE7HKA557:Advantages: 1. Low Power Consumption: The LS1012ASE7HKA557 chip is designed to operate with low power consumption, making it suitable for battery-powered devices and energy-efficient applications. 2. High Performance: Despite its low power consumption, the LS1012ASE7HKA557 chip offers high-performance capabilities, enabling it to handle complex tasks and applications. 3. Integrated Connectivity: The chip includes integrated connectivity features such as Ethernet, USB, and PCIe, allowing for easy integration into networked systems and IoT applications. 4. Security Features: The LS1012ASE7HKA557 chip incorporates various security features, including secure boot, secure storage, and cryptographic acceleration, ensuring data integrity and protection against unauthorized access. 5. Small Form Factor: The chip comes in a compact form factor, making it suitable for space-constrained applications and devices.Application Scenarios: 1. IoT Gateways: The LS1012ASE7HKA557 chip can be used in IoT gateways to connect and manage multiple IoT devices, enabling data aggregation, processing, and communication with cloud services. 2. Industrial Automation: With its low power consumption and high performance, the chip is suitable for industrial automation applications, such as control systems, monitoring devices, and data acquisition systems. 3. Smart Home Devices: The LS1012ASE7HKA557 chip can be utilized in smart home devices, including smart thermostats, security systems, and home automation controllers, providing connectivity and processing capabilities. 4. Edge Computing: Due to its compact size and integrated connectivity, the chip is well-suited for edge computing applications, where data processing and analytics are performed at the edge of the network, reducing latency and bandwidth requirements. 5. Network Appliances: The LS1012ASE7HKA557 chip can be used in network appliances like routers, switches, and firewalls, providing networking capabilities and security features.These are just a few examples of the advantages and application scenarios of the LS1012ASE7HKA557 chip. The versatility and features of the chip make it suitable for a wide range of embedded systems and IoT applications.
M2S005S-VFG256 Relevant information
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TA7S20-60GI
Analog Devices Inc. -
QN9020/DY
Hittite -
CY8C21534-PVXE
Cypress Semiconductor Corp -
CY8C21434A24LTXIKC
Cypress Semiconductor Corp -
CY8C21534-12PVXET
Cypress Semiconductor Corp -
TA7S20-60GI
Analog Devices Inc. -
SAF3604EL/V3040AY
NXP USA Inc. -
SAF3604EL/V3040BY
NXP USA Inc. -
SAF3604EL/V3040BK
NXP USA Inc. -
SAF3604EL/V3040AK
NXP USA Inc.