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MPFS095TLS-FCSG325I

MPFS095TLS-FCSG325I

Manufacturer No:

MPFS095TLS-FCSG325I

Manufacturer:

Microchip Technology

Description:

IC SOC RISC-V 325LFBGA

Datasheet:

Datasheet

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MPFS095TLS-FCSG325I Specifications

  • Type
    Parameter
  • Supplier Device Package
    325-LFBGA (11x14.5)
  • Package / Case
    325-LFBGA
  • Operating Temperature
    -40°C ~ 100°C
  • Primary Attributes
    FPGA - 93K Logic Modules
  • Speed
    -
  • Connectivity
    CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, PCI, PWM
  • RAM Size
    857.6kB
  • Flash Size
    128KB
  • Core Processor
    RISC-V
  • Architecture
    MPU, FPGA
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    PolarFire®
The MCIMX6Q5EYM10ACR is an integrated circuit chip from the i.MX6 series of processors developed by NXP Semiconductors. It is specifically designed for applications in the automotive industry. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The MCIMX6Q5EYM10ACR is based on the ARM Cortex-A9 architecture and features a quad-core processor, providing high processing power for demanding applications. 2. Graphics and Multimedia Capabilities: The chip includes a Vivante GC2000 2D/3D graphics processing unit (GPU) and supports multiple video codecs, enabling advanced graphics and multimedia processing. 3. Connectivity Options: It offers various connectivity options such as Ethernet, USB, CAN, and FlexRay, allowing seamless integration with other automotive systems and networks. 4. Automotive-Grade: The chip is designed to meet the stringent requirements of the automotive industry, including extended temperature ranges, high reliability, and long-term availability.Application Scenarios: 1. Infotainment Systems: The MCIMX6Q5EYM10ACR can be used in automotive infotainment systems to provide advanced multimedia capabilities, including high-definition video playback, 3D graphics, and connectivity for external devices. 2. Advanced Driver Assistance Systems (ADAS): The chip's high processing power and graphics capabilities make it suitable for ADAS applications such as object detection, lane departure warning, and collision avoidance systems. 3. Instrument Clusters: It can be used in automotive instrument clusters to provide high-resolution displays, graphical user interfaces, and real-time information to the driver. 4. Telematics: The chip's connectivity options make it suitable for telematics applications, enabling features like vehicle tracking, remote diagnostics, and over-the-air software updates. 5. Gateway Modules: It can be used as a gateway module to connect different automotive networks and protocols, facilitating communication between various systems within a vehicle.Overall, the MCIMX6Q5EYM10ACR chip offers high performance, graphics capabilities, and automotive-grade reliability, making it suitable for a wide range of applications in the automotive industry.
MPFS095TLS-FCSG325I Relevant information