TDA4VL21HGAALZRQ1
Manufacturer No:
TDA4VL21HGAALZRQ1
Manufacturer:
Description:
AUTOMOTIVE SYSTEM-ON-A-CHIP WITH
Datasheet:
Delivery:
Payment:
In Stock : 250
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TDA4VL21HGAALZRQ1 Specifications
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TypeParameter
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Supplier Device Package770-FCBGA (23x23)
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Package / Case770-BFBGA, FCBGA
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Operating Temperature-40°C ~ 125°C (TJ)
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Primary Attributes-
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Speed2GHz, 1GHz, 1GHz
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ConnectivityMCAN, MMC/SD/SDIO, I²C, SPI, UART, USB
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PeripheralsDMA, PWM, WDT
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RAM Size1.5MB
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Flash Size-
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Core ProcessorARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
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ArchitectureDSP, MCU, MPU
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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SeriesAutomotive, AEC-Q100
TDA4VL21HGAALZRQ1 Relevant information
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TA7S20-60GI
Analog Devices Inc. -
QN9020/DY
Hittite -
CY8C21534-PVXE
Cypress Semiconductor Corp -
CY8C21434A24LTXIKC
Cypress Semiconductor Corp -
CY8C21534-12PVXET
Cypress Semiconductor Corp -
TA7S20-60GI
Analog Devices Inc. -
SAF3604EL/V3040AY
NXP USA Inc. -
SAF3604EL/V3040BY
NXP USA Inc. -
SAF3604EL/V3040BK
NXP USA Inc. -
SAF3604EL/V3040AK
NXP USA Inc.