CY7C341B-25JC

CY7C341B-25JC

Manufacturer No:

CY7C341B-25JC

Manufacturer:

Infineon Technologies

Description:

IC PLD 192MC 25NS 84PLCC

Datasheet:

Datasheet

Delivery:

Payment:

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CY7C341B-25JC Specifications

  • Type
    Parameter
  • Supplier Device Package
    84-PLCC (29.31x29.31)
  • Package / Case
    84-LCC (J-Lead)
  • Mounting Type
    Surface Mount
  • Speed
    25 ns
  • Voltage - Input
    5V
  • Number of Macrocells
    192
  • Programmable Type
    EPLD
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XCZU4EV-1FBVB900I is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The XCZU4EV-1FBVB900I chip provides high-performance processing capabilities with its quad-core ARM Cortex-A53 processor and dual-core ARM Cortex-R5 real-time processor. It also includes programmable logic resources, making it suitable for a wide range of applications. 2. Programmability: The chip's programmable logic resources allow for customization and flexibility. Users can implement custom hardware accelerators, interfaces, and algorithms, enabling them to tailor the chip to their specific application requirements. 3. Integration: The XCZU4EV-1FBVB900I integrates multiple components into a single chip, including processors, programmable logic, memory interfaces, and various peripherals. This integration reduces the need for external components, simplifying the overall system design and reducing costs. 4. Power Efficiency: The chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. It incorporates power management features to optimize power usage and extend battery life in portable devices. 5. Scalability: The XCZU4EV-1FBVB900I chip is part of the Zynq UltraScale+ MPSoC family, which offers different models with varying levels of performance and features. This scalability allows users to choose the appropriate chip for their specific application requirements.Application Scenarios: 1. Embedded Systems: The XCZU4EV-1FBVB900I chip is commonly used in embedded systems that require high-performance processing capabilities along with programmable logic. It can be used in applications such as industrial automation, robotics, automotive systems, and aerospace. 2. Edge Computing: With its processing power and programmability, the chip is suitable for edge computing applications. It can perform real-time data processing and analysis at the edge of the network, reducing latency and enabling faster decision-making. 3. Video and Image Processing: The XCZU4EV-1FBVB900I chip's high-performance processing capabilities make it well-suited for video and image processing applications. It can handle tasks such as video encoding/decoding, image recognition, and computer vision algorithms. 4. Wireless Communication: The chip's integration of processors and programmable logic makes it suitable for wireless communication applications. It can be used in base stations, software-defined radios, and wireless infrastructure equipment. 5. High-Performance Computing: The XCZU4EV-1FBVB900I chip's processing power and programmability also make it suitable for high-performance computing applications. It can be used in areas such as scientific research, data centers, and cloud computing.These are just a few examples of the advantages and application scenarios of the XCZU4EV-1FBVB900I integrated circuit chip. The specific usage depends on the requirements and needs of the application being developed.