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ATF22LV10C-10SI

ATF22LV10C-10SI

Manufacturer No:

ATF22LV10C-10SI

Manufacturer:

Microchip Technology

Description:

IC PLD 10MC 10NS 24SOIC

Datasheet:

Datasheet

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ATF22LV10C-10SI Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-SOIC
  • Package / Case
    24-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Speed
    10 ns
  • Voltage - Input
    3.3V
  • Number of Macrocells
    10
  • Programmable Type
    EE PLD
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    22V10
The R8A77610DA01BGV#YE is an integrated circuit chip developed by Renesas Electronics Corporation. It is a system-on-chip (SoC) designed for automotive applications. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The R8A77610DA01BGV#YE chip offers a high-performance ARM Cortex-A9 dual-core processor, which enables efficient processing of complex tasks and applications. 2. Automotive Grade: This chip is specifically designed for automotive applications, ensuring reliability, durability, and compliance with automotive industry standards. 3. Integrated Features: It integrates various peripherals and interfaces such as CAN, Ethernet, USB, and audio interfaces, reducing the need for additional external components. 4. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for automotive systems where power efficiency is crucial. 5. Enhanced Security: It incorporates security features like secure boot and tamper detection, providing protection against unauthorized access and ensuring the integrity of the system.Application Scenarios: 1. Infotainment Systems: The R8A77610DA01BGV#YE chip can be used in automotive infotainment systems, providing high-performance processing capabilities for multimedia playback, navigation, connectivity, and user interface. 2. Advanced Driver Assistance Systems (ADAS): It can be utilized in ADAS applications, enabling real-time processing of sensor data, image recognition, and decision-making algorithms for features like lane departure warning, collision avoidance, and adaptive cruise control. 3. Instrument Clusters: The chip can be employed in automotive instrument clusters, offering powerful processing for rendering graphics, displaying vehicle information, and supporting advanced features like heads-up displays. 4. Telematics: It can be used in telematics systems, enabling connectivity, data processing, and communication capabilities for services like remote diagnostics, vehicle tracking, and emergency assistance. 5. Gateway Modules: The chip can be utilized in automotive gateway modules, facilitating communication between different in-vehicle networks and protocols, ensuring seamless integration of various systems.Overall, the R8A77610DA01BGV#YE chip provides high performance, integration, and automotive-grade reliability, making it suitable for a wide range of automotive applications.
ATF22LV10C-10SI Relevant information