PAL16R8-7JC

PAL16R8-7JC

Manufacturer No:

PAL16R8-7JC

Manufacturer:

Vantis

Description:

OT PLD, 7.5NS, PAL-TYPE, TTL, PQ

Datasheet:

Datasheet

Delivery:

Payment:

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PAL16R8-7JC Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-CDIP
  • Package / Case
    20-CDIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Speed
    -
  • Voltage - Input
    4.75V ~ 5.25V
  • Number of Macrocells
    8
  • Programmable Type
    PAL
  • DigiKey Programmable
    Not Verified
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The R8A77610DA01BGV#W9 is an integrated circuit chip developed by Renesas Electronics Corporation. It is a system-on-chip (SoC) designed for automotive applications. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The R8A77610DA01BGV#W9 chip offers high-performance processing capabilities, enabling it to handle complex automotive applications efficiently. 2. Low Power Consumption: It is designed to be power-efficient, ensuring optimal energy usage in automotive systems. 3. Integrated Features: The chip integrates various functionalities, including a microcontroller unit (MCU), graphics processing unit (GPU), and connectivity interfaces, reducing the need for additional components. 4. Automotive-Grade Reliability: The chip is designed to meet the stringent requirements of the automotive industry, ensuring reliability and durability in harsh environments. 5. Safety and Security: It incorporates safety and security features, such as secure boot and cryptographic acceleration, to protect automotive systems from unauthorized access and ensure data integrity.Application Scenarios: 1. Infotainment Systems: The R8A77610DA01BGV#W9 chip can be used in automotive infotainment systems, providing high-performance graphics processing for multimedia applications, including audio/video playback, navigation, and connectivity features. 2. Advanced Driver Assistance Systems (ADAS): It can be utilized in ADAS applications, such as camera-based driver assistance systems, providing the necessary processing power for real-time image recognition, object detection, and collision avoidance. 3. Instrument Clusters: The chip can be employed in automotive instrument clusters, enabling high-resolution graphics rendering for displaying vehicle information, including speed, fuel level, and warning indicators. 4. Gateway Modules: It can be used in automotive gateway modules, facilitating communication between different in-vehicle networks, such as CAN, Ethernet, and LIN, ensuring seamless data exchange between various automotive systems. 5. Telematics: The chip can be utilized in automotive telematics systems, enabling connectivity features like GPS navigation, remote vehicle diagnostics, and over-the-air software updates.Overall, the R8A77610DA01BGV#W9 chip offers high performance, low power consumption, and integrated features, making it suitable for various automotive applications that require reliable and efficient processing capabilities.