PAL20X8ACNS
Manufacturer No:
PAL20X8ACNS
Manufacturer:
Description:
OT PLD, 30NS, PAL-TYPE
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PAL20X8ACNS Specifications
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TypeParameter
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Supplier Device Package24-PDIP
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Package / Case24-DIP (0.300", 7.62mm)
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Mounting TypeThrough Hole
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Speed30 ns
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Voltage - Input4.75V ~ 5.25V
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Number of Macrocells10
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Programmable TypePAL
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DigiKey ProgrammableNot Verified
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PackagingBulk
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Product StatusActive
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Series-
The R8A77610DA01BGV#YC is a specific model of integrated circuit chip manufactured by Renesas Electronics. While specific advantages and application scenarios may vary depending on the requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The R8A77610DA01BGV#YC chip is designed to deliver high performance, making it suitable for demanding applications. 2. Low Power Consumption: It is optimized for low power consumption, making it suitable for battery-powered devices or energy-efficient applications. 3. Integrated Features: The chip integrates various features and peripherals, reducing the need for external components and simplifying the overall system design. 4. Scalability: The chip offers scalability, allowing it to be used in a wide range of applications with varying requirements. 5. Reliability: Renesas Electronics is a reputable semiconductor manufacturer known for producing reliable and high-quality chips.Application Scenarios: 1. Automotive Systems: The R8A77610DA01BGV#YC chip can be used in automotive systems, such as infotainment systems, instrument clusters, or advanced driver-assistance systems (ADAS). 2. Industrial Automation: It can be utilized in industrial automation applications, including factory automation, robotics, or control systems. 3. Consumer Electronics: The chip can find applications in consumer electronics devices like smart TVs, set-top boxes, or home entertainment systems. 4. Medical Devices: It can be used in medical devices, such as patient monitoring systems, medical imaging equipment, or diagnostic devices. 5. Internet of Things (IoT): The chip's low power consumption and integrated features make it suitable for IoT applications, including smart home devices, wearables, or connected sensors.It's important to note that the specific advantages and application scenarios may vary based on the requirements and capabilities of the R8A77610DA01BGV#YC chip. It is recommended to refer to the manufacturer's documentation and specifications for detailed information.
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