TIBPAL20L8-7CFN
Manufacturer No:
TIBPAL20L8-7CFN
Manufacturer:
Description:
OT PLD, 9NS, PAL-TYPE, TTL,
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TIBPAL20L8-7CFN Specifications
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TypeParameter
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Supplier Device Package-
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Mounting Type-
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Voltage - Input-
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DigiKey ProgrammableNot Verified
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PackagingBulk
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Product StatusActive
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Series*
The XCZU4EV-3FBVB900E is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some key points:Advantages: 1. Versatility: The XCZU4EV-3FBVB900E chip combines a high-performance processing system (PS) with programmable logic (PL) in a single device. This allows for flexible and customizable designs, making it suitable for a wide range of applications. 2. High-performance processing: The chip features a quad-core ARM Cortex-A53 processor, which provides significant processing power for running complex algorithms and applications. 3. Programmable logic: The PL section of the chip consists of programmable logic cells, DSP slices, and other configurable resources. This enables hardware acceleration and customization of specific functions, improving performance and efficiency. 4. Integrated peripherals: The XCZU4EV-3FBVB900E chip includes various peripherals such as USB, Ethernet, PCIe, and memory interfaces. These integrated peripherals simplify system design and reduce the need for additional components. 5. Low power consumption: The chip is designed to be power-efficient, making it suitable for applications where energy consumption is a concern.Application scenarios: 1. Embedded systems: The XCZU4EV-3FBVB900E chip is commonly used in embedded systems that require a combination of high-performance processing and programmable logic. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Edge computing: With its processing power and programmable logic, the chip is well-suited for edge computing applications. It can handle real-time data processing, machine learning, and AI inference tasks at the edge of the network. 3. Video and image processing: The XCZU4EV-3FBVB900E chip's capabilities make it suitable for video and image processing applications. It can handle tasks like video encoding/decoding, image recognition, and computer vision algorithms. 4. Wireless communication: The chip's integrated peripherals and processing power make it suitable for wireless communication systems. It can be used in applications such as base stations, software-defined radios, and wireless network infrastructure. 5. High-performance computing: The XCZU4EV-3FBVB900E chip's combination of processing power and programmable logic makes it useful in high-performance computing applications. It can accelerate computationally intensive tasks and improve overall system performance.These are just a few examples of the advantages and application scenarios of the XCZU4EV-3FBVB900E chip. The specific usage will depend on the requirements and design goals of the system being developed.
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