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PALCE20V8H-20E4/BLA

PALCE20V8H-20E4/BLA

Manufacturer No:

PALCE20V8H-20E4/BLA

Manufacturer:

Advanced Micro Devices

Description:

ELECTRICALLY ERASABLE PAL DEVICE

Datasheet:

Datasheet

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PALCE20V8H-20E4/BLA Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-CDIP
  • Package / Case
    24-CDIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Speed
    20 ns
  • Voltage - Input
    4.5V ~ 5.5V
  • Number of Macrocells
    8
  • Programmable Type
    PAL
  • DigiKey Programmable
    Not Verified
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The XCZU5EV-3FBVB900E is a specific model from the Xilinx Zynq UltraScale+ RFSoC (Radio Frequency System-on-Chip) family of integrated circuit (IC) chips. These chips offer a combination of programmable logic, processing system features, and integrated RF data converters. The advantages and application scenarios of the XCZU5EV-3FBVB900E are as follows:Advantages: 1. Integration: The XCZU5EV-3FBVB900E chip integrates the functionalities of a high-performance processing system, programmable logic, and RF data converters within a single chip, simplifying the design and reducing the overall system complexity. 2. Flexible programmability: With programmable logic (reconfigurable FPGA fabric) and programmable processing cores (ARM Cortex-A53), the XCZU5EV-3FBVB900E offers flexibility in implementing custom functionalities, supporting a wide range of applications. 3. Reduced power consumption: The Zynq UltraScale+ architecture includes power optimization techniques, allowing for efficient power usage, thus reducing energy consumption. 4. High-speed data converters: The XCZU5EV-3FBVB900E incorporates integrated RF data converters, such as ADCs (Analog-to-Digital Converters) and DACs (Digital-to-Analog Converters), enabling direct RF signal processing without the need for external components.Application Scenarios: 1. Wireless Communication: The XCZU5EV-3FBVB900E chip finds applications in wireless communication systems such as cellular base stations, remote radio heads, software-defined radios, and small cell solutions. The integrated RF data converters enable direct RF sampling and processing, facilitating communication signal processing tasks. 2. Aerospace and Defense: The chip's combination of programmable logic, processing capabilities, and integrated RF functionality makes it suitable for aerospace and defense applications. It can be used in radar systems, electronic warfare, satellite communication, and secure communication systems. 3. Advanced Imaging: The XCZU5EV-3FBVB900E can be utilized in applications requiring high-speed image and video processing, such as medical imaging, industrial automation, and surveillance systems. The programmable fabric enables real-time processing of image and video data with customizable algorithms. 4. Industrial Internet of Things (IIoT): In IIoT applications, where real-time data processing and connectivity are crucial, the XCZU5EV-3FBVB900E can be used for edge computing, protocol conversion, and advanced analytics. Its combination of programmability and integrated RF capability enables handling various IIoT communication protocols and sensor interfaces.These advantages and application scenarios demonstrate the XCZU5EV-3FBVB900E's versatility in different domains requiring a combination of processing power, programmability, and RF functionalities.
PALCE20V8H-20E4/BLA Relevant information