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TIFPLA840CNT

TIFPLA840CNT

Manufacturer No:

TIFPLA840CNT

Manufacturer:

Texas Instruments

Description:

OT PLD, 25NS, PLA-TYPE

Datasheet:

Datasheet

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TIFPLA840CNT Specifications

  • Type
    Parameter
  • Speed
    -
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Voltage - Input
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    *
The XCZU4EV-L1FBVB900I is an integrated circuit chip from Xilinx, specifically from their Zynq UltraScale+ MPSoC family. This chip offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the XCZU4EV-L1FBVB900I chip are:Advantages: 1. High Performance: The XCZU4EV-L1FBVB900I chip combines a high-performance ARM processor with programmable logic, enabling it to handle complex tasks efficiently. 2. Programmability: The chip's programmable logic allows for customization and flexibility, making it suitable for a wide range of applications. 3. Power Efficiency: The XCZU4EV-L1FBVB900I chip is designed to be power-efficient, making it suitable for applications where energy consumption is a concern. 4. Integrated Features: The chip integrates various peripherals and interfaces, reducing the need for additional components and simplifying system design. 5. Scalability: The XCZU4EV-L1FBVB900I chip is part of the Zynq UltraScale+ MPSoC family, which offers different variants with varying levels of performance and features. This allows for scalability and the ability to choose the right chip for specific application requirements.Application Scenarios: 1. Embedded Systems: The XCZU4EV-L1FBVB900I chip is well-suited for embedded systems that require a combination of processing power and programmable logic. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Edge Computing: With its high-performance ARM processor and programmable logic, the chip can be used in edge computing scenarios where real-time processing and AI acceleration are required. This includes applications like video analytics, machine vision, and IoT gateways. 3. Communications: The XCZU4EV-L1FBVB900I chip's integrated features, such as high-speed interfaces and DSP capabilities, make it suitable for communication applications like wireless base stations, software-defined radios, and network switches. 4. Medical Imaging: The chip's processing power and programmable logic can be utilized in medical imaging systems, enabling tasks like image processing, pattern recognition, and real-time analysis. 5. Aerospace and Defense: The XCZU4EV-L1FBVB900I chip's high-performance capabilities and power efficiency make it suitable for aerospace and defense applications, including radar systems, avionics, and secure communication systems.It's important to note that the specific application scenarios may vary depending on the system requirements and the overall design considerations.
TIFPLA840CNT Relevant information