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PAL20L8B2CNS

PAL20L8B2CNS

Manufacturer No:

PAL20L8B2CNS

Manufacturer:

Vantis

Description:

VANTIS PLD

Datasheet:

Datasheet

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PAL20L8B2CNS Specifications

  • Type
    Parameter
  • Speed
    25 ns
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    Through Hole
  • Voltage - Input
    5V
  • Number of Macrocells
    64
  • Programmable Type
    PAL
  • DigiKey Programmable
    Not Verified
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    PAL20L8
The XC7Z035-L2FBG676I is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Zynq-7000 family of programmable SoCs (System on Chips) and offers a range of advantages and application scenarios. Some of these are:1. Programmability: The XC7Z035-L2FBG676I chip is highly programmable, allowing users to configure it for a wide range of applications. It combines a dual-core ARM Cortex-A9 processor with programmable logic, enabling both software and hardware customization.2. High-performance processing: With its dual-core ARM Cortex-A9 processor running at up to 800 MHz, the chip provides significant processing power. This makes it suitable for applications that require real-time processing, high-speed data handling, and complex algorithms.3. FPGA integration: The XC7Z035-L2FBG676I chip integrates FPGA (Field-Programmable Gate Array) fabric alongside the ARM processor. This allows for hardware acceleration, parallel processing, and the ability to implement custom logic functions directly on the chip.4. Low power consumption: The chip is designed to be power-efficient, making it suitable for applications where energy consumption is a concern. It offers power management features and can dynamically adjust power usage based on the workload.5. Connectivity options: The XC7Z035-L2FBG676I chip provides various connectivity options, including Ethernet, USB, CAN, I2C, SPI, and more. This makes it suitable for applications that require communication with other devices or networks.6. Industrial-grade reliability: The chip is designed to meet industrial-grade reliability standards, making it suitable for applications in harsh environments. It can withstand extended temperature ranges, high vibration, and other challenging conditions.Application scenarios for the XC7Z035-L2FBG676I chip include:1. Embedded systems: The chip's combination of processing power, programmability, and FPGA integration makes it suitable for various embedded system applications. This includes industrial automation, robotics, automotive electronics, and aerospace systems.2. High-performance computing: The chip's ability to handle complex algorithms and parallel processing makes it suitable for high-performance computing applications. This includes data centers, scientific research, and signal processing.3. Internet of Things (IoT): The chip's low power consumption, connectivity options, and programmability make it suitable for IoT applications. It can be used in smart home devices, industrial IoT solutions, and edge computing systems.4. Video and image processing: The chip's processing power and FPGA integration make it suitable for video and image processing applications. This includes video surveillance, medical imaging, and multimedia systems.5. Communication systems: The chip's connectivity options and programmability make it suitable for communication systems. It can be used in wireless base stations, network switches, and software-defined radios.Overall, the XC7Z035-L2FBG676I chip offers a versatile combination of processing power, programmability, and connectivity options, making it suitable for a wide range of applications in various industries.
PAL20L8B2CNS Relevant information