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PALCE20V8H-25E4/BLA

PALCE20V8H-25E4/BLA

Manufacturer No:

PALCE20V8H-25E4/BLA

Manufacturer:

Advanced Micro Devices

Description:

ELECTRICALLY ERASABLE PAL DEVICE

Datasheet:

Datasheet

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PALCE20V8H-25E4/BLA Specifications

  • Type
    Parameter
  • Speed
    25 ns
  • Voltage - Input
    4.5V ~ 5.5V
  • Supplier Device Package
    24-CDIP
  • Package / Case
    24-CDIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Number of Macrocells
    8
  • Programmable Type
    PAL
  • DigiKey Programmable
    Not Verified
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The XCZU5EG-3FBVB900E is an integrated circuit chip that belongs to the Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family developed by Xilinx. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The XCZU5EG-3FBVB900E combines a high-performance processing system with programmable logic, making it suitable for a wide range of applications. 2. Processing power: The chip features a quad-core ARM Cortex-A53 processor which provides substantial processing power for demanding tasks. 3. Programmable logic and FPGA fabric: The Xilinx FPGA fabric on the chip allows for hardware acceleration and custom hardware designs, enabling unparalleled flexibility and performance optimization. 4. Real-time processing: The chip includes ARM Cortex-R5 processors, which are designed for real-time and safety-critical applications. 5. High-speed connectivity: It supports a variety of high-speed interfaces such as PCIe, DDR4, USB 3.0, Ethernet, etc., enabling fast communication with external devices.Application Scenarios: 1. Embedded systems: The XCZU5EG-3FBVB900E can be utilized in embedded systems, such as industrial automation, robotics, and automotive applications, where real-time processing, high-performance computing, and hardware acceleration are crucial. 2. Artificial Intelligence and Machine Learning: The chip's processing power and programmable logic make it suitable for AI and ML applications, including neural network acceleration, computer vision, and natural language processing. 3. Wireless communication: The XCZU5EG-3FBVB900E can be used in wireless communication systems, including 5G base stations, small cells, and wireless access points, for high-speed data processing and connectivity. 4. High-performance computing: It is well-suited for high-performance computing applications, such as scientific simulations, data analytics, and cloud infrastructure, where parallel processing capabilities and FPGA acceleration can deliver significant performance gains.Overall, the XCZU5EG-3FBVB900E IC chips offer versatility, high processing power, programmable logic, and connectivity options, making them suitable for a wide range of applications across various industries.
PALCE20V8H-25E4/BLA Relevant information