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MOD5270BXX

MOD5270BXX

Manufacturer No:

MOD5270BXX

Manufacturer:

NXP USA Inc.

Description:

IC MOD COLDFIRE 95MHZ 2.064MB

Datasheet:

Datasheet

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MOD5270BXX Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 70°C
  • Size / Dimension
    2.600" L x 2.000" W (66.04mm x 50.80mm)
  • Connector Type
    RJ-45, 2x50 Header
  • RAM Size
    2.064MB
  • Flash Size
    512KB
  • Speed
    95MHz
  • Co-Processor
    -
  • Core Processor
    ColdFire 5270
  • Module/Board Type
    MCU, Ethernet Core
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    -
The MOD5270BXX integrated circuit chips have several advantages and application scenarios:1. High Performance: The MOD5270BXX chips are based on the ColdFire V2 core, which offers high performance and efficient processing capabilities. This makes them suitable for applications that require fast and reliable processing, such as industrial control systems, robotics, and automation.2. Connectivity: These chips come with built-in Ethernet and USB interfaces, enabling seamless connectivity to networks and other devices. This makes them ideal for applications that require network communication, such as IoT devices, data loggers, and network gateways.3. Memory and Storage: The MOD5270BXX chips have a large on-chip memory and support external memory expansion, allowing for the storage of large amounts of data. This makes them suitable for applications that require data-intensive operations, such as multimedia devices, embedded systems, and data acquisition systems.4. Real-Time Capabilities: These chips have real-time clock (RTC) functionality and support real-time operating systems (RTOS), enabling precise timing and synchronization. This makes them suitable for applications that require time-sensitive operations, such as real-time monitoring systems, control systems, and embedded systems.5. Low Power Consumption: The MOD5270BXX chips are designed to be power-efficient, making them suitable for battery-powered or energy-constrained applications. This includes portable devices, wireless sensor networks, and low-power embedded systems.6. Industrial Grade: These chips are designed to operate in harsh environments and are built to withstand high temperatures, vibrations, and electromagnetic interference. This makes them suitable for industrial applications, such as factory automation, process control, and monitoring systems.Overall, the MOD5270BXX integrated circuit chips offer high performance, connectivity, memory, real-time capabilities, low power consumption, and industrial-grade reliability, making them suitable for a wide range of applications in various industries.
MOD5270BXX Relevant information