MOD5270BXCE

MOD5270BXCE

Manufacturer No:

MOD5270BXCE

Manufacturer:

NXP USA Inc.

Description:

IC MOD COLDFIRE 95MHZ 2.064MB

Datasheet:

Datasheet

Delivery:

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MOD5270BXCE Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 70°C
  • Size / Dimension
    2.600" L x 2.000" W (66.04mm x 50.80mm)
  • Connector Type
    RJ-45, 2x50 Header
  • RAM Size
    2.064MB
  • Flash Size
    512KB
  • Speed
    95MHz
  • Co-Processor
    -
  • Core Processor
    ColdFire 5270
  • Module/Board Type
    MCU, Ethernet Core
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    -
The MOD5270BXCE integrated circuit chips have several advantages and application scenarios:1. High Performance: The MOD5270BXCE chips are based on the ColdFire V2 core, which offers high performance and efficient processing capabilities. This makes them suitable for applications that require fast and reliable processing, such as industrial automation, robotics, and automotive systems.2. Connectivity: These chips come with various connectivity options, including Ethernet, USB, CAN, and serial interfaces. This makes them ideal for applications that require network connectivity and communication, such as IoT devices, gateways, and data loggers.3. Memory and Storage: The MOD5270BXCE chips have a large on-chip memory and support external memory expansion. This allows for storing and processing large amounts of data, making them suitable for applications that require data-intensive operations, such as multimedia devices, data acquisition systems, and embedded computing.4. Real-Time Capabilities: These chips have built-in real-time clock (RTC) and timers, enabling them to perform time-sensitive tasks and handle real-time data processing. This makes them suitable for applications that require precise timing and synchronization, such as control systems, instrumentation, and medical devices.5. Low Power Consumption: The MOD5270BXCE chips are designed to operate at low power, making them suitable for battery-powered and energy-efficient applications. This includes portable devices, wearable technology, and remote monitoring systems.6. Development and Customization: These chips are supported by a comprehensive software development kit (SDK) and development tools, allowing for easy programming and customization. This makes them suitable for a wide range of applications, as developers can tailor the functionality and features according to their specific requirements.Overall, the MOD5270BXCE integrated circuit chips offer high performance, connectivity, memory, real-time capabilities, low power consumption, and customization options, making them suitable for a variety of applications in industries such as industrial automation, IoT, robotics, automotive, and more.