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TE0813-01-4BE11-A

TE0813-01-4BE11-A

Manufacturer No:

TE0813-01-4BE11-A

Manufacturer:

Trenz Electronic GmbH

Description:

MODULE MPSOC 4GB DDR4

Datasheet:

Datasheet

Delivery:

Payment:

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TE0813-01-4BE11-A Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Connector Type
    Board-to-Board (BTB) Socket
  • RAM Size
    2GB
  • Flash Size
    128MB
  • Speed
    -
  • Co-Processor
    -
  • Core Processor
    Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E
  • Module/Board Type
    FPGA Core
  • Packaging
    Box
  • Product Status
    Discontinued at Digi-Key
  • Series
    -
The TE0813-01-4BE11-A integrated circuit chips have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: These chips are designed to deliver high performance with their advanced architecture and optimized circuitry. 2. Versatility: They can be used in a wide range of applications due to their flexible design and compatibility with various systems. 3. Low Power Consumption: These chips are energy-efficient, consuming minimal power during operation, making them suitable for battery-powered devices. 4. Compact Size: The TE0813-01-4BE11-A chips are compact in size, allowing for easy integration into small form factor devices. 5. Reliability: These chips are built with high-quality materials and undergo rigorous testing, ensuring their reliability and durability.Application Scenarios: 1. Embedded Systems: The TE0813-01-4BE11-A chips can be used in embedded systems such as industrial automation, robotics, and IoT devices. 2. Communication Systems: These chips can be utilized in communication systems like routers, switches, and network equipment for efficient data processing. 3. Medical Devices: They can be integrated into medical devices like patient monitoring systems, diagnostic equipment, and medical imaging devices. 4. Automotive Electronics: The TE0813-01-4BE11-A chips can be employed in automotive electronics for applications like advanced driver-assistance systems (ADAS), infotainment systems, and engine control units. 5. Aerospace and Defense: These chips can be used in aerospace and defense applications, including avionics systems, radar systems, and military communication systems.Overall, the TE0813-01-4BE11-A integrated circuit chips offer high performance, versatility, and reliability, making them suitable for various applications across different industries.
TE0813-01-4BE11-A Relevant information