TE0823-01-3PIU1FA
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TE0823-01-3PIU1FA
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Description:
ICOBOARD
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TE0823-01-3PIU1FA Specifications
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TypeParameter
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Operating Temperature-40°C ~ 85°C
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Size / Dimension1.970" L x 1.570" W (50.00mm x 40.00mm)
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Connector TypeUSB
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RAM Size1GB
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Flash Size128MB
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Speed-
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Co-ProcessorXilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
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Core ProcessorARM Cortex-A53, ARM® Cortex®-R5
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Module/Board TypeMCU, FPGA
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PackagingBulk
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Product StatusObsolete
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SeriesTE0823
The TE0823-01-3PIU1FA is an integrated circuit chip developed by Trenz Electronic. It is based on the Xilinx Zynq UltraScale+ MPSoC platform and offers several advantages and application scenarios:Advantages: 1. High Performance: The chip combines a powerful Arm Cortex-A53 quad-core processor with a programmable FPGA fabric, providing high-performance processing capabilities. 2. Flexibility: The programmable FPGA fabric allows users to customize and accelerate specific functions, making it suitable for a wide range of applications. 3. System Integration: The chip integrates multiple components, including processor cores, FPGA fabric, memory, and peripherals, reducing the need for external components and simplifying system design. 4. Power Efficiency: The chip is designed to optimize power consumption, making it suitable for applications with strict power constraints. 5. Scalability: The chip supports various memory and storage options, allowing for scalability based on application requirements.Application Scenarios: 1. Embedded Systems: The TE0823-01-3PIU1FA chip can be used in embedded systems that require high-performance processing and customizable functionality. It is suitable for applications such as industrial automation, robotics, and automotive systems. 2. Edge Computing: With its powerful processing capabilities and FPGA fabric, the chip can be used in edge computing applications, enabling real-time data processing and analysis at the edge of the network. 3. High-Speed Data Processing: The chip's FPGA fabric can be utilized to accelerate data processing tasks, making it suitable for applications such as high-frequency trading, signal processing, and image/video processing. 4. Communication Systems: The chip's integrated peripherals and FPGA fabric can be used to implement communication protocols and interfaces, making it suitable for applications in telecommunications, networking, and wireless communication. 5. Aerospace and Defense: The chip's high-performance processing capabilities and flexibility make it suitable for aerospace and defense applications, including radar systems, avionics, and secure communication systems.Overall, the TE0823-01-3PIU1FA integrated circuit chip offers a combination of high-performance processing, flexibility, and system integration, making it suitable for a wide range of applications in various industries.
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