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TE0720-03-61Q33ML

TE0720-03-61Q33ML

Manufacturer No:

TE0720-03-61Q33ML

Manufacturer:

Trenz Electronic GmbH

Description:

IC SOC MODULE XILINX ZYNQ

Datasheet:

Datasheet

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TE0720-03-61Q33ML Specifications

  • Type
    Parameter
  • Operating Temperature
    -40°C ~ 85°C
  • Size / Dimension
    1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Connector Type
    Samtec LSHM
  • RAM Size
    1GB
  • Flash Size
    8GB
  • Speed
    -
  • Co-Processor
    Zynq-7000 (Z-7020)
  • Core Processor
    ARM Cortex-A9
  • Module/Board Type
    MCU, FPGA
  • Packaging
    Bulk
  • Product Status
    Discontinued at Digi-Key
  • Series
    TE0720
The TE0720-03-61Q33ML is an integrated circuit chip developed by Trenz Electronic. It is a System-on-Module (SoM) based on the Xilinx Zynq-7000 All Programmable SoC, which combines a dual-core ARM Cortex-A9 processor with an FPGA fabric.Advantages of the TE0720-03-61Q33ML chip:1. Versatility: The integration of a powerful ARM processor and FPGA fabric provides a versatile platform for a wide range of applications. It allows for both software and hardware development, enabling the implementation of complex algorithms and real-time processing.2. High-performance processing: The dual-core ARM Cortex-A9 processor offers high-performance processing capabilities, making it suitable for applications that require significant computational power.3. Programmability: The FPGA fabric allows for the implementation of custom hardware accelerators and interfaces, providing flexibility and customization options. It enables the chip to be tailored to specific application requirements.4. Low power consumption: The TE0720-03-61Q33ML chip is designed to be power-efficient, making it suitable for applications where power consumption is a critical factor.Application scenarios of the TE0720-03-61Q33ML chip:1. Embedded systems: The chip can be used in various embedded systems applications, such as industrial automation, robotics, and IoT devices. Its combination of processing power and programmability makes it suitable for controlling and interfacing with various peripherals and sensors.2. High-performance computing: The TE0720-03-61Q33ML chip can be utilized in applications that require high-performance computing, such as image and signal processing, machine learning, and data analytics. The FPGA fabric allows for the acceleration of computationally intensive tasks.3. Communication systems: The chip can be used in communication systems, including software-defined radios (SDR), wireless base stations, and network switches. Its processing capabilities and programmability enable the implementation of advanced communication protocols and signal processing algorithms.4. Test and measurement equipment: The TE0720-03-61Q33ML chip can be employed in test and measurement equipment, such as oscilloscopes, spectrum analyzers, and data acquisition systems. Its FPGA fabric allows for the implementation of custom interfaces and signal processing algorithms, enabling precise measurements and analysis.Overall, the TE0720-03-61Q33ML chip offers a combination of processing power, programmability, and versatility, making it suitable for a wide range of applications that require high-performance computing, customization, and low power consumption.
TE0720-03-61Q33ML Relevant information