TE0720-03-S007C1

TE0720-03-S007C1

Manufacturer No:

TE0720-03-S007C1

Manufacturer:

Trenz Electronic GmbH

Description:

IC SOC MODULE XILINX ZYNQ

Datasheet:

Datasheet

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TE0720-03-S007C1 Specifications

  • Type
    Parameter
  • Operating Temperature
    -
  • Size / Dimension
    1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Connector Type
    Samtec LSHM
  • RAM Size
    -
  • Flash Size
    8GB
  • Speed
    -
  • Co-Processor
    Zynq-7000 (Z-7020)
  • Core Processor
    ARM Cortex-A9
  • Module/Board Type
    MCU, FPGA
  • Packaging
    Bulk
  • Product Status
    Discontinued at Digi-Key
  • Series
    TE0720
The TE0720-03-S007C1 is an integrated circuit chip developed by Trenz Electronic. It is a System-on-Module (SoM) based on the Xilinx Zynq-7000 All Programmable SoC, which combines a dual-core ARM Cortex-A9 processor with programmable logic.Advantages of the TE0720-03-S007C1 chip:1. High Performance: The chip features a powerful dual-core ARM Cortex-A9 processor, which provides high-performance processing capabilities for various applications.2. Programmable Logic: The chip includes programmable logic resources, allowing users to implement custom hardware accelerators or interfaces to meet specific application requirements.3. Integrated Peripherals: The chip integrates various peripherals such as Ethernet, USB, UART, SPI, I2C, and GPIO, providing flexibility for connecting to external devices.4. Small Form Factor: The TE0720-03-S007C1 chip is designed as a compact System-on-Module, making it suitable for applications with space constraints.Application scenarios of the TE0720-03-S007C1 chip:1. Embedded Systems: The chip can be used in embedded systems that require high-performance processing and programmable logic capabilities, such as industrial automation, robotics, and automotive applications.2. IoT Devices: The chip's integrated peripherals and programmable logic make it suitable for IoT devices that require connectivity, sensor interfaces, and custom hardware accelerators.3. Prototyping and Development: The TE0720-03-S007C1 chip can be used for rapid prototyping and development of complex systems, allowing engineers to quickly test and validate their designs.4. High-Performance Computing: The chip's dual-core ARM Cortex-A9 processor and programmable logic resources make it suitable for applications that require high-performance computing, such as image processing, machine learning, and data analytics.Overall, the TE0720-03-S007C1 chip offers a combination of high-performance processing, programmable logic, and integrated peripherals, making it versatile for a wide range of applications in various industries.