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TE0720-03-61Q33FAB

TE0720-03-61Q33FAB

Manufacturer No:

TE0720-03-61Q33FAB

Manufacturer:

Trenz Electronic GmbH

Description:

IC SOC MODULE XILINX ZYNQ

Datasheet:

Datasheet

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TE0720-03-61Q33FAB Specifications

  • Type
    Parameter
  • Operating Temperature
    -
  • Size / Dimension
    -
  • Connector Type
    -
  • RAM Size
    -
  • Flash Size
    8GB
  • Speed
    -
  • Co-Processor
    Zynq-7000 (Z-7020)
  • Core Processor
    -
  • Module/Board Type
    MCU, FPGA
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    TE0720
The TE0720-03-61Q33FAB is an integrated circuit chip developed by Trenz Electronic. It is a System-on-Module (SoM) based on the Xilinx Zynq-7000 All Programmable SoC, which combines a dual-core ARM Cortex-A9 processor with an FPGA fabric.Advantages of the TE0720-03-61Q33FAB chip:1. Versatility: The integration of a powerful ARM processor and FPGA fabric allows for a wide range of applications. It can be used for embedded systems, industrial automation, robotics, image processing, and more.2. High-performance processing: The dual-core ARM Cortex-A9 processor provides high-performance processing capabilities, enabling complex algorithms and applications to be executed efficiently.3. Programmable logic: The FPGA fabric allows for custom hardware acceleration and real-time processing. It can be programmed to implement specific functions, interfaces, or algorithms, providing flexibility and customization options.4. Low power consumption: The TE0720-03-61Q33FAB chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications.5. Compact form factor: The chip is available in a small form factor, making it suitable for space-constrained applications or designs where size is a critical factor.Application scenarios of the TE0720-03-61Q33FAB chip:1. Industrial automation: The chip can be used in industrial control systems, PLCs (Programmable Logic Controllers), and SCADA (Supervisory Control and Data Acquisition) systems. Its processing power and FPGA fabric enable real-time control, data acquisition, and communication with various industrial devices.2. Robotics: The chip can be utilized in robotics applications for motor control, sensor interfacing, image processing, and AI algorithms. The FPGA fabric can be programmed to implement custom control algorithms or accelerate computationally intensive tasks.3. Image and video processing: The TE0720-03-61Q33FAB chip can be used for real-time image and video processing applications, such as surveillance systems, machine vision, or medical imaging. The FPGA fabric can be programmed to perform image filtering, object detection, or video compression.4. IoT (Internet of Things) devices: The chip can be integrated into IoT devices, providing processing power, connectivity options, and the ability to interface with various sensors and actuators. Its low power consumption makes it suitable for battery-powered IoT applications.5. Embedded systems: The TE0720-03-61Q33FAB chip can be used in various embedded systems, including automotive electronics, aerospace applications, or consumer electronics. Its combination of ARM processor and FPGA fabric allows for complex system integration and customization.Overall, the TE0720-03-61Q33FAB chip offers a versatile and powerful solution for a wide range of applications, combining high-performance processing with programmable logic capabilities.
TE0720-03-61Q33FAB Relevant information