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TE0720-03-S003C1

TE0720-03-S003C1

Manufacturer No:

TE0720-03-S003C1

Manufacturer:

Trenz Electronic GmbH

Description:

IC SOC MODULE XILINX ZYNQ

Datasheet:

Datasheet

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TE0720-03-S003C1 Specifications

  • Type
    Parameter
  • Operating Temperature
    -
  • Size / Dimension
    -
  • Connector Type
    -
  • RAM Size
    -
  • Flash Size
    8GB
  • Speed
    -
  • Co-Processor
    Zynq-7000 (Z-7020)
  • Core Processor
    -
  • Module/Board Type
    MCU, FPGA
  • Packaging
    Bulk
  • Product Status
    Discontinued at Digi-Key
  • Series
    TE0720
The TE0720-03-S003C1 is an integrated circuit chip developed by Trenz Electronic. It is a System-on-Module (SoM) based on the Xilinx Zynq-7000 All Programmable SoC, which combines a dual-core ARM Cortex-A9 processor with programmable logic.Advantages of the TE0720-03-S003C1 chip:1. High Performance: The dual-core ARM Cortex-A9 processor provides high processing power, making it suitable for applications that require intensive computation.2. Programmable Logic: The integrated programmable logic allows for the implementation of custom hardware accelerators, enabling the chip to handle specialized tasks efficiently.3. Flexibility: The chip offers a wide range of I/O interfaces, including Ethernet, USB, UART, SPI, I2C, and GPIO, making it versatile and adaptable to various application scenarios.4. Small Form Factor: The TE0720-03-S003C1 chip is compact and designed for easy integration into different systems, making it suitable for space-constrained applications.Application scenarios of the TE0720-03-S003C1 chip:1. Embedded Systems: The chip can be used in embedded systems that require high-performance processing, such as industrial automation, robotics, and machine vision applications.2. IoT Devices: With its connectivity options and processing power, the chip can be used in IoT devices that require edge computing capabilities, such as smart home automation, industrial monitoring, and remote sensing applications.3. Prototyping and Development: The TE0720-03-S003C1 chip can be used as a development platform for prototyping and testing new designs, allowing engineers to quickly iterate and validate their ideas.4. High-Speed Data Processing: The chip's programmable logic can be utilized to implement custom hardware accelerators for tasks like image processing, signal processing, and data encryption, enabling high-speed data processing applications.Overall, the TE0720-03-S003C1 chip offers a combination of processing power, flexibility, and compactness, making it suitable for a wide range of applications that require high-performance computing and programmable logic capabilities.
TE0720-03-S003C1 Relevant information