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TE0745-02-81C11-AK

TE0745-02-81C11-AK

Manufacturer No:

TE0745-02-81C11-AK

Manufacturer:

Trenz Electronic GmbH

Description:

MOD SOM DDR3L 1GB

Datasheet:

Datasheet

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TE0745-02-81C11-AK Specifications

  • Type
    Parameter
  • Operating Temperature
    -40°C ~ 85°C
  • Size / Dimension
    2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Connector Type
    Board-to-Board (BTB) Socket - 480
  • RAM Size
    1GB
  • Flash Size
    64MB
  • Speed
    -
  • Co-Processor
    Zynq-7000 (Z-7035)
  • Core Processor
    ARM Cortex-A9
  • Module/Board Type
    MCU, FPGA
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    TE0745
The TE0745-02-81C11-AK integrated circuit chips, also known as FPGA modules, have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: These chips are based on Field-Programmable Gate Array (FPGA) technology, which allows for high-speed processing and parallel computing capabilities. 2. Flexibility: FPGAs can be reprogrammed and reconfigured to perform different tasks, making them highly adaptable to changing requirements. 3. Customization: These chips can be programmed to implement custom logic functions, making them suitable for a wide range of applications. 4. Integration: FPGA modules often come with various peripherals and interfaces, allowing for easy integration with other components and systems. 5. Low Power Consumption: FPGAs can be optimized for power efficiency, making them suitable for battery-powered or energy-constrained applications. 6. Real-Time Processing: The parallel processing capabilities of FPGAs enable real-time data processing and response, making them suitable for applications that require high-speed data processing.Application Scenarios: 1. Digital Signal Processing (DSP): FPGAs are commonly used in DSP applications such as audio and video processing, image recognition, and compression/decompression algorithms. 2. Communications: These chips are used in networking equipment, wireless communication systems, and software-defined radios (SDRs) for high-speed data processing and protocol implementation. 3. Industrial Automation: FPGAs are utilized in industrial control systems, robotics, and machine vision applications for real-time control, sensor interfacing, and image processing. 4. Aerospace and Defense: These chips find applications in radar systems, avionics, satellite communication, and encryption/decryption algorithms due to their high performance and reliability. 5. Internet of Things (IoT): FPGAs can be used in IoT devices for sensor data processing, edge computing, and implementing custom IoT protocols. 6. Medical Devices: These chips are employed in medical imaging systems, patient monitoring devices, and DNA sequencing equipment for high-speed data processing and analysis.It is important to note that the specific advantages and application scenarios of the TE0745-02-81C11-AK chips may vary depending on the manufacturer's specifications and the specific implementation requirements.
TE0745-02-81C11-AK Relevant information