TE0712-02-82C36-P

TE0712-02-82C36-P

Manufacturer No:

TE0712-02-82C36-P

Manufacturer:

Trenz Electronic GmbH

Description:

FPGA MODULE ARTIX7

Datasheet:

Datasheet

Delivery:

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TE0712-02-82C36-P Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Connector Type
    Samtec LSHM
  • RAM Size
    1GB
  • Flash Size
    32MB
  • Speed
    200MHz
  • Co-Processor
    -
  • Core Processor
    -
  • Module/Board Type
    FPGA Core
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    TE0712
The TE0712-02-82C36-P is an integrated circuit chip developed by Trenz Electronic. It is specifically designed for use in embedded systems and offers several advantages and application scenarios. Some of these include:1. High Performance: The TE0712-02-82C36-P chip is based on the Xilinx Zynq-7000 All Programmable System-on-Chip (SoC) architecture. It combines a dual-core ARM Cortex-A9 processor with programmable logic, providing high-performance computing capabilities.2. Programmability: The chip's programmable logic allows users to implement custom hardware accelerators, interfaces, and other functionalities. This flexibility makes it suitable for a wide range of applications where specific hardware requirements need to be met.3. System Integration: The TE0712-02-82C36-P chip integrates multiple components into a single device, including the processor, programmable logic, memory interfaces, and various peripherals. This integration simplifies system design and reduces the overall footprint of the embedded system.4. Real-Time Processing: The TE0712-02-82C36-P chip supports real-time processing capabilities, making it suitable for applications that require deterministic and low-latency responses. This can include industrial automation, robotics, and real-time control systems.5. Communication Interfaces: The chip provides various communication interfaces such as Ethernet, USB, UART, SPI, I2C, and CAN. These interfaces enable seamless connectivity with external devices and systems, making it suitable for applications that require data exchange and communication.6. Industrial Applications: The TE0712-02-82C36-P chip is designed to operate in harsh industrial environments. It has a wide temperature range and is resistant to shock and vibration, making it suitable for applications in industrial automation, transportation, and other rugged environments.7. Embedded Systems: The TE0712-02-82C36-P chip is commonly used in embedded systems, where it can be integrated into custom-designed boards or used with off-the-shelf development boards. It is suitable for applications such as industrial control, medical devices, automotive systems, and aerospace.Overall, the TE0712-02-82C36-P chip offers high performance, flexibility, and integration capabilities, making it suitable for a wide range of embedded system applications that require real-time processing, communication, and customization.