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TE0729-02-62I63FA

TE0729-02-62I63FA

Manufacturer No:

TE0729-02-62I63FA

Manufacturer:

Trenz Electronic GmbH

Description:

IC SOC MODULE ZYNQ

Datasheet:

Datasheet

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TE0729-02-62I63FA Specifications

  • Type
    Parameter
  • Operating Temperature
    -40°C ~ 85°C
  • Size / Dimension
    2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Connector Type
    B2B
  • RAM Size
    512MB
  • Flash Size
    32MB
  • Speed
    -
  • Co-Processor
    Zynq-7000 (Z-7020)
  • Core Processor
    ARM Cortex-A9
  • Module/Board Type
    MCU, FPGA
  • Packaging
    Bulk
  • Product Status
    Discontinued at Digi-Key
  • Series
    -
The TE0729-02-62I63FA is an integrated circuit chip developed by Trenz Electronic. It is a System-on-Module (SoM) based on the Xilinx Zynq-7000 All Programmable SoC, which combines a dual-core ARM Cortex-A9 processor with an FPGA fabric.Advantages of the TE0729-02-62I63FA chip:1. Versatility: The integration of a powerful ARM processor and FPGA fabric allows for a wide range of applications. The ARM processor can handle high-level tasks, while the FPGA fabric provides flexibility for hardware acceleration and real-time processing.2. High-performance processing: The dual-core ARM Cortex-A9 processor provides high-performance processing capabilities, making it suitable for applications that require significant computational power.3. Programmability: The FPGA fabric in the chip is programmable, allowing users to customize and optimize the hardware for specific applications. This flexibility is particularly useful in scenarios where real-time processing or hardware acceleration is required.4. Compact form factor: The TE0729-02-62I63FA chip is designed as a System-on-Module, which means it is a compact and self-contained unit. This makes it easy to integrate into existing systems or prototypes, reducing development time and effort.Application scenarios of the TE0729-02-62I63FA chip:1. Embedded systems: The combination of ARM processor and FPGA fabric makes the chip suitable for embedded systems development. It can be used in applications such as industrial automation, robotics, and IoT devices, where real-time processing, high-performance computing, and hardware customization are required.2. Signal processing: The FPGA fabric in the chip can be used for real-time signal processing tasks, such as audio and video processing, image recognition, and data compression. The ARM processor can handle high-level control and interface tasks, while the FPGA fabric accelerates the computationally intensive signal processing algorithms.3. Prototyping and development: The TE0729-02-62I63FA chip is often used in prototyping and development of complex systems. Its compact form factor and programmability allow engineers to quickly test and iterate on their designs, reducing time to market.4. High-performance computing: The chip's dual-core ARM Cortex-A9 processor, combined with the FPGA fabric, can be used for high-performance computing applications. It can be used in scenarios such as data centers, scientific research, and simulation, where parallel processing and hardware acceleration are crucial.Overall, the TE0729-02-62I63FA chip offers a versatile and powerful solution for a wide range of applications, combining the benefits of an ARM processor and FPGA fabric in a compact form factor.
TE0729-02-62I63FA Relevant information