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TE0720-03-2IFC1

TE0720-03-2IFC1

Manufacturer No:

TE0720-03-2IFC1

Manufacturer:

Trenz Electronic GmbH

Description:

IC SOC MODULE XILINX ZYNQ

Datasheet:

Datasheet

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TE0720-03-2IFC1 Specifications

  • Type
    Parameter
  • Operating Temperature
    -40°C ~ 85°C
  • Size / Dimension
    1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Connector Type
    Samtec LSHM
  • RAM Size
    1GB
  • Flash Size
    4GB
  • Speed
    125MHz
  • Co-Processor
    Zynq-7000 (Z-7020)
  • Core Processor
    ARM Cortex-A9
  • Module/Board Type
    MCU, FPGA
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    TE0720
The TE0720-03-2IFC1 is an integrated circuit chip developed by Trenz Electronic. It is a System-on-Module (SoM) based on the Xilinx Zynq-7000 All Programmable SoC, which combines a dual-core ARM Cortex-A9 processor with programmable logic.Advantages of the TE0720-03-2IFC1 chip:1. High Performance: The dual-core ARM Cortex-A9 processor provides high-performance processing capabilities, making it suitable for applications that require significant computational power.2. Programmable Logic: The integrated programmable logic allows for the implementation of custom hardware accelerators, enabling the chip to handle complex tasks efficiently.3. Flexibility: The TE0720-03-2IFC1 chip offers a wide range of I/O interfaces, including Ethernet, USB, UART, SPI, I2C, and GPIO, providing flexibility for various application requirements.4. Small Form Factor: The chip is designed as a compact System-on-Module, making it suitable for space-constrained applications.Application scenarios of the TE0720-03-2IFC1 chip:1. Embedded Systems: The TE0720-03-2IFC1 chip can be used in embedded systems that require high-performance processing and custom hardware acceleration. It is suitable for applications such as industrial automation, robotics, and machine vision.2. IoT Devices: With its small form factor and various I/O interfaces, the chip can be used in IoT devices that require both processing power and connectivity. It can be utilized in applications like smart home automation, edge computing, and industrial IoT.3. Prototyping and Development: The TE0720-03-2IFC1 chip is often used in prototyping and development projects due to its flexibility and programmability. It allows engineers to quickly develop and test their designs before moving to production.4. High-Speed Data Processing: The chip's programmable logic can be utilized to implement high-speed data processing algorithms, making it suitable for applications such as digital signal processing, image processing, and real-time data analysis.Overall, the TE0720-03-2IFC1 chip offers a combination of high-performance processing, programmable logic, and flexibility, making it suitable for a wide range of applications in various industries.
TE0720-03-2IFC1 Relevant information