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TE0720-03-62I33FAN

TE0720-03-62I33FAN

Manufacturer No:

TE0720-03-62I33FAN

Manufacturer:

Trenz Electronic GmbH

Description:

IC SOC MODULE XILINX ZYNQ

Datasheet:

Datasheet

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TE0720-03-62I33FAN Specifications

  • Type
    Parameter
  • Operating Temperature
    -40°C ~ 85°C
  • Size / Dimension
    1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Connector Type
    Samtec LSHM
  • RAM Size
    1GB
  • Flash Size
    4GB
  • Speed
    125MHz
  • Co-Processor
    Zynq-7000 (Z-7020)
  • Core Processor
    ARM Cortex-A9
  • Module/Board Type
    MCU, FPGA
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    TE0720
The TE0720-03-62I33FAN is an integrated circuit chip developed by Trenz Electronic. It is a System-on-Module (SoM) based on the Xilinx Zynq-7000 All Programmable SoC, which combines a dual-core ARM Cortex-A9 processor with an FPGA fabric.Advantages of the TE0720-03-62I33FAN chip:1. Versatility: The integration of a powerful ARM processor and FPGA fabric allows for a wide range of applications. It can be used for embedded systems, industrial automation, robotics, image processing, and more.2. High-performance processing: The dual-core ARM Cortex-A9 processor provides efficient and powerful processing capabilities, making it suitable for applications that require real-time processing or high-speed data handling.3. Programmability: The FPGA fabric on the chip allows for hardware customization and acceleration. It can be programmed to implement custom logic, algorithms, or interfaces, providing flexibility and performance optimization.4. Small form factor: The TE0720-03-62I33FAN chip is designed as a compact System-on-Module, making it suitable for space-constrained applications. It can be easily integrated into existing systems or used as a standalone module.Application scenarios of the TE0720-03-62I33FAN chip:1. Industrial automation: The chip can be used in industrial control systems, PLCs (Programmable Logic Controllers), or SCADA (Supervisory Control and Data Acquisition) systems. Its processing power and FPGA fabric enable real-time control, data acquisition, and communication with various industrial devices.2. Robotics: The TE0720-03-62I33FAN chip can be utilized in robotic systems for control, vision processing, and sensor integration. The FPGA fabric can be programmed to implement custom control algorithms or interfaces, enabling precise and efficient robot control.3. Image and signal processing: The chip's processing capabilities make it suitable for applications that involve image or signal processing, such as machine vision systems, video analytics, or digital signal processing. The FPGA fabric can be used to accelerate computationally intensive tasks or implement custom image processing algorithms.4. Embedded systems: The TE0720-03-62I33FAN chip can be used as a core component in various embedded systems, including IoT (Internet of Things) devices, edge computing platforms, or custom embedded solutions. Its small form factor and versatile capabilities make it suitable for a wide range of applications.Overall, the TE0720-03-62I33FAN chip offers a combination of processing power, programmability, and compactness, making it suitable for various applications that require high-performance processing, customization, and integration in a small form factor.
TE0720-03-62I33FAN Relevant information