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TE0715-04-15-1IC

TE0715-04-15-1IC

Manufacturer No:

TE0715-04-15-1IC

Manufacturer:

Trenz Electronic GmbH

Description:

IC SOC MODULE 1GB DDR3L

Datasheet:

Datasheet

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TE0715-04-15-1IC Specifications

  • Type
    Parameter
  • Operating Temperature
    -40°C ~ 85°C
  • Size / Dimension
    1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Connector Type
    Samtec LSHM
  • RAM Size
    1GB
  • Flash Size
    32MB
  • Speed
    125MHz
  • Co-Processor
    Zynq-7000 (Z-7015)
  • Core Processor
    ARM Cortex-A9
  • Module/Board Type
    MCU, FPGA
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    TE0715
The TE0715-04-15-1IC integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The TE0715-04-15-1IC chips are designed to deliver high performance with a clock frequency of up to 667 MHz. This makes them suitable for applications that require fast processing speeds. 2. Low Power Consumption: These chips are designed to be power-efficient, making them suitable for battery-powered or low-power applications. 3. Small Form Factor: The TE0715-04-15-1IC chips are compact and have a small form factor, making them suitable for applications with space constraints. 4. High-Speed Interfaces: These chips support high-speed interfaces such as Gigabit Ethernet, USB, and PCIe, enabling connectivity with other devices and systems. 5. FPGA Integration: The TE0715-04-15-1IC chips integrate a Xilinx Zynq-7000 FPGA, which combines the flexibility of programmable logic with the processing power of an ARM Cortex-A9 processor. This allows for the implementation of custom logic and software processing in a single chip.Application Scenarios: 1. Embedded Systems: The TE0715-04-15-1IC chips are commonly used in embedded systems where high-performance processing and programmable logic are required. They can be used in applications such as industrial automation, robotics, and automotive systems. 2. Communication Systems: These chips can be used in communication systems that require high-speed interfaces and processing capabilities. They can be used in applications such as network routers, switches, and base stations. 3. Image and Video Processing: The TE0715-04-15-1IC chips can be used in applications that involve image and video processing, such as surveillance systems, medical imaging, and video analytics. 4. IoT and Edge Computing: With their low power consumption and compact form factor, these chips are suitable for IoT devices and edge computing applications. They can be used in smart home devices, wearable technology, and edge servers. 5. Test and Measurement Equipment: The TE0715-04-15-1IC chips can be used in test and measurement equipment that requires high-speed data acquisition, signal processing, and control capabilities.Overall, the TE0715-04-15-1IC integrated circuit chips offer high performance, low power consumption, and FPGA integration, making them suitable for a wide range of applications that require processing power, programmable logic, and connectivity.
TE0715-04-15-1IC Relevant information