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TE0820-04-3BE21FL

TE0820-04-3BE21FL

Manufacturer No:

TE0820-04-3BE21FL

Manufacturer:

Trenz Electronic GmbH

Description:

MOD MPSOC ZU3EG-1E 2GB DDR4 IND

Datasheet:

Datasheet

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TE0820-04-3BE21FL Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Connector Type
    Samtec LSHM
  • RAM Size
    2GB
  • Flash Size
    128MB
  • Speed
    -
  • Co-Processor
    -
  • Core Processor
    Zynq UltraScale+ XCZU3EG-1SFVC784E
  • Module/Board Type
    MPU Core
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    TE0820
The TE0820-04-3BE21FL is an integrated circuit chip developed by Trenz Electronic. It is a System-on-Module (SoM) based on the Xilinx Zynq UltraScale+ MPSoC. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The TE0820-04-3BE21FL chip is based on the Xilinx Zynq UltraScale+ MPSoC, which combines a powerful Arm Cortex-A53 quad-core processor with a programmable FPGA fabric. This allows for high-performance computing and flexible hardware acceleration.2. Versatility: The chip offers a wide range of I/O interfaces, including USB, Ethernet, HDMI, PCIe, and more. This makes it suitable for various applications that require connectivity and data transfer.3. Scalability: The TE0820-04-3BE21FL chip is designed as a System-on-Module, which means it can be easily integrated into different hardware platforms. This allows for scalability and customization based on specific application requirements.Application Scenarios: 1. Embedded Systems: The TE0820-04-3BE21FL chip is suitable for embedded systems that require high-performance processing and real-time control. It can be used in applications such as industrial automation, robotics, and machine vision.2. Edge Computing: With its powerful processing capabilities, the chip is well-suited for edge computing applications. It can perform complex data processing tasks locally, reducing latency and bandwidth requirements for cloud-based processing.3. High-Speed Data Acquisition: The TE0820-04-3BE21FL chip's FPGA fabric can be used for high-speed data acquisition and processing. It is suitable for applications such as software-defined radio, digital signal processing, and data logging.4. Prototyping and Development: The chip can be used as a development platform for prototyping and testing new designs. Its flexibility and programmability allow for rapid development and iteration of hardware and software solutions.Overall, the TE0820-04-3BE21FL integrated circuit chip offers high performance, versatility, and scalability, making it suitable for a wide range of applications in embedded systems, edge computing, high-speed data acquisition, and prototyping.
TE0820-04-3BE21FL Relevant information