TE0820-04-3BE21FA

TE0820-04-3BE21FA

Manufacturer No:

TE0820-04-3BE21FA

Manufacturer:

Trenz Electronic GmbH

Description:

MOD MPSOC ZU3EG-1E 2GB DDR4 IND

Datasheet:

Datasheet

Delivery:

Payment:

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TE0820-04-3BE21FA Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Connector Type
    Samtec LSHM
  • RAM Size
    2GB
  • Flash Size
    128MB
  • Speed
    -
  • Co-Processor
    -
  • Core Processor
    Zynq UltraScale+ XCZU3EG-1SFVC784E
  • Module/Board Type
    MPU Core
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    TE0820
The TE0820-04-3BE21FA is an integrated circuit chip from Trenz Electronic. It is a system-on-module (SoM) based on the Xilinx Zynq UltraScale+ MPSoC. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The TE0820-04-3BE21FA chip is based on the powerful Xilinx Zynq UltraScale+ MPSoC, which combines a quad-core ARM Cortex-A53 processor with a high-performance programmable logic fabric. This allows for high-speed processing and efficient execution of complex tasks. 2. Programmability: The chip's programmable logic fabric enables users to customize and optimize the hardware for specific applications. This flexibility is particularly useful in scenarios where specific hardware acceleration or customization is required. 3. Integrated Features: The TE0820-04-3BE21FA chip integrates various peripherals and interfaces, including Ethernet, USB, HDMI, PCIe, and more. This integration simplifies the design process and reduces the need for additional external components. 4. Small Form Factor: The chip is designed as a compact system-on-module, making it suitable for applications with space constraints. It can be easily integrated into existing systems or used as a standalone module.Application Scenarios: 1. Embedded Systems: The TE0820-04-3BE21FA chip is well-suited for embedded systems that require high-performance processing and programmability. It can be used in applications such as industrial automation, robotics, and machine vision. 2. Edge Computing: With its powerful processing capabilities, the chip is suitable for edge computing applications. It can perform real-time analytics and decision-making at the edge of the network, reducing latency and improving overall system performance. 3. High-Speed Data Processing: The chip's programmable logic fabric and integrated interfaces make it ideal for applications that require high-speed data processing, such as data acquisition, signal processing, and image/video processing. 4. Communication Systems: The TE0820-04-3BE21FA chip's integrated Ethernet and PCIe interfaces make it suitable for communication systems that require high-speed data transfer and networking capabilities. It can be used in applications such as network routers, switches, and gateways.Overall, the TE0820-04-3BE21FA chip offers high performance, programmability, and integration, making it suitable for a wide range of applications that require advanced processing capabilities and customization options.