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TE0820-04-4AE21FA

TE0820-04-4AE21FA

Manufacturer No:

TE0820-04-4AE21FA

Manufacturer:

Trenz Electronic GmbH

Description:

MOD MPSOC ZU4CG-1E 2GB DDR4 IND

Datasheet:

Datasheet

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TE0820-04-4AE21FA Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Connector Type
    Samtec LSHM
  • RAM Size
    2GB
  • Flash Size
    128MB
  • Speed
    -
  • Co-Processor
    -
  • Core Processor
    Zynq UltraScale+ XCZU4CG-1SFVC784E
  • Module/Board Type
    MPU Core
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    TE0820
The TE0820-04-4AE21FA is an integrated circuit chip developed by Trenz Electronic. It is based on the Xilinx Zynq UltraScale+ MPSoC platform and offers several advantages and application scenarios. Some of them include:1. High-performance processing: The TE0820-04-4AE21FA chip combines a powerful Arm Cortex-A53 quad-core processor with a programmable FPGA fabric. This allows for high-performance processing capabilities, making it suitable for applications that require intensive computation and real-time processing.2. Programmability: The integrated FPGA fabric in the chip provides flexibility and programmability. It allows users to implement custom logic and algorithms, making it ideal for applications that require hardware acceleration or specialized processing.3. System integration: The TE0820-04-4AE21FA chip integrates multiple components into a single device, including the processor, FPGA, memory, and various peripherals. This simplifies system design and reduces the overall footprint, making it suitable for space-constrained applications.4. Connectivity options: The chip offers a wide range of connectivity options, including Ethernet, USB, PCIe, and various serial interfaces. This enables seamless integration with other devices and systems, making it suitable for applications that require communication and data transfer.5. Industrial-grade reliability: The TE0820-04-4AE21FA chip is designed to meet industrial-grade requirements, including extended temperature range, high reliability, and robustness. This makes it suitable for applications in harsh environments, such as industrial automation, robotics, and automotive.Application scenarios for the TE0820-04-4AE21FA chip include:1. Embedded systems: The chip can be used in embedded systems that require high-performance processing, real-time capabilities, and custom logic implementation. This includes applications in industrial automation, medical devices, aerospace, and defense.2. Edge computing: The TE0820-04-4AE21FA chip can be utilized in edge computing scenarios where data processing and analysis need to be performed locally, close to the data source. This includes applications in IoT, smart cities, and surveillance systems.3. High-speed data processing: The chip's FPGA fabric and connectivity options make it suitable for applications that require high-speed data processing, such as data centers, network infrastructure, and telecommunications.4. Prototyping and development: The TE0820-04-4AE21FA chip can be used for rapid prototyping and development of complex systems. Its programmability and integration capabilities allow for quick iterations and testing of different functionalities.Overall, the TE0820-04-4AE21FA integrated circuit chip offers a combination of high-performance processing, programmability, system integration, and industrial-grade reliability, making it suitable for a wide range of applications in various industries.
TE0820-04-4AE21FA Relevant information