Home / Microcontrollers, Microprocessor, FPGA Modules / L138-FI-236-RC/
L138-FI-236-RC

L138-FI-236-RC

Manufacturer No:

L138-FI-236-RC

Manufacturer:

Critical Link LLC

Description:

MOD MITYDSP-L138F OMAP-L138

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

L138-FI-236-RC Specifications

  • Type
    Parameter
  • Operating Temperature
    -40°C ~ 70°C
  • Size / Dimension
    2.660" L x 2.000" W (67.60mm x 50.80mm)
  • Connector Type
    SO-DIMM-200
  • RAM Size
    8kB (Internal), 256MB (External)
  • Flash Size
    512MB (NAND), 8MB (NOR)
  • Speed
    456MHz
  • Co-Processor
    TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
  • Core Processor
    ARM926EJ-S, OMAP-L138
  • Module/Board Type
    MPU, DSP, FPGA Core
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    MityDSP-L138F
The L138-FI-236-RC integrated circuit (IC) chips have several advantages and application scenarios. Here are some of them:Advantages: 1. Low power consumption: The L138-FI-236-RC chips are designed to operate with low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 2. High performance: These chips offer high processing power and performance, enabling them to handle complex tasks and applications efficiently. 3. Integrated peripherals: The L138-FI-236-RC chips come with various integrated peripherals such as UART, I2C, SPI, GPIO, and timers, which simplify the design and reduce the need for external components. 4. Real-time processing capabilities: These chips are capable of real-time processing, making them suitable for applications that require quick response times or time-sensitive operations. 5. Flexible programming options: The L138-FI-236-RC chips support programming in both C and assembly languages, providing flexibility to developers based on their preferences and requirements.Application Scenarios: 1. Embedded systems: The L138-FI-236-RC chips are commonly used in embedded systems, such as industrial automation, robotics, smart appliances, and IoT devices, where low power consumption, high performance, and real-time processing are essential. 2. Audio and voice processing: These chips can be utilized in applications that involve audio and voice processing, such as voice recognition systems, audio recording/playback devices, and speech synthesis. 3. Data acquisition and control: The integrated peripherals of the L138-FI-236-RC chips make them suitable for applications involving data acquisition and control, such as sensor interfaces, data loggers, and control systems. 4. Wireless communication: These chips can be used in wireless communication applications, including wireless sensor networks, remote monitoring systems, and wireless data transmission devices. 5. Medical devices: The low power consumption and real-time processing capabilities of the L138-FI-236-RC chips make them suitable for medical devices like patient monitoring systems, portable medical instruments, and wearable health trackers.Overall, the L138-FI-236-RC integrated circuit chips offer a combination of low power consumption, high performance, and integrated peripherals, making them versatile for various applications in embedded systems, audio processing, data acquisition, wireless communication, and medical devices.
L138-FI-236-RC Relevant information