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OSD32MP157C-512M-BAA-ES

OSD32MP157C-512M-BAA-ES

Manufacturer No:

OSD32MP157C-512M-BAA-ES

Manufacturer:

Octavo Systems LLC

Description:

SIP ARM CORTEX STM32MP157C

Datasheet:

Datasheet

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OSD32MP157C-512M-BAA-ES Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    0.709" L x 0.709" W (18.00mm x 18.00mm)
  • Connector Type
    302-BGA
  • RAM Size
    512MB
  • Flash Size
    -
  • Speed
    650MHz, 209MHz
  • Co-Processor
    NEON™ SIMD
  • Core Processor
    Arm® Dual Cortex®-A7, Arm® Cortex®-M4
  • Module/Board Type
    MPU Core
  • Packaging
    Tray
  • Product Status
    Discontinued at Digi-Key
  • Series
    OSD32MP15x
The OSD32MP157C-512M-BAA-ES is an integrated circuit chip that offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of this chip are:Advantages: 1. High Performance: The OSD32MP157C-512M-BAA-ES chip is based on the Arm Cortex-A7 architecture, which provides high processing power and performance. 2. Low Power Consumption: This chip is designed to be energy-efficient, making it suitable for battery-powered devices or applications where power consumption is a concern. 3. Integrated Graphics Processing Unit (GPU): The chip includes a 3D graphics processing unit, which enables the development of applications that require graphical rendering or acceleration. 4. Rich Connectivity Options: The OSD32MP157C-512M-BAA-ES chip offers various connectivity options, including Ethernet, USB, CAN, SPI, I2C, and UART, making it suitable for applications that require communication with other devices or networks. 5. Secure Boot and Cryptography: The chip includes security features like secure boot and cryptographic acceleration, ensuring the integrity and confidentiality of data.Application Scenarios: 1. Industrial Automation: The high performance and low power consumption of this chip make it suitable for industrial automation applications, such as programmable logic controllers (PLCs), human-machine interfaces (HMIs), or industrial gateways. 2. Internet of Things (IoT): The rich connectivity options and low power consumption make this chip ideal for IoT devices, such as smart home devices, wearables, or environmental sensors. 3. Multimedia Applications: The integrated GPU and high processing power of the chip enable it to handle multimedia applications, such as digital signage, media players, or video surveillance systems. 4. Edge Computing: The chip's processing power and connectivity options make it suitable for edge computing scenarios, where data processing and analysis are performed at the edge of the network, reducing latency and bandwidth requirements. 5. Automotive: The chip's features, including secure boot and connectivity options like CAN, make it suitable for automotive applications, such as infotainment systems, telematics, or advanced driver-assistance systems (ADAS).These are just a few examples of the advantages and application scenarios of the OSD32MP157C-512M-BAA-ES chip. Its versatility and capabilities make it suitable for a wide range of embedded system applications.
OSD32MP157C-512M-BAA-ES Relevant information