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TE0745-02-81C11-A

TE0745-02-81C11-A

Manufacturer No:

TE0745-02-81C11-A

Manufacturer:

Trenz Electronic GmbH

Description:

SOM MIT XILINX ZYNQ

Datasheet:

Datasheet

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TE0745-02-81C11-A Specifications

  • Type
    Parameter
  • Operating Temperature
    -40°C ~ 85°C
  • Size / Dimension
    2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Connector Type
    Samtec ST5
  • RAM Size
    1GB
  • Flash Size
    32MB
  • Speed
    -
  • Co-Processor
    Zynq-7000 (Z-7035)
  • Core Processor
    ARM® Cortex®-A9
  • Module/Board Type
    MCU, FPGA
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    TE0745
The TE0745-02-81C11-A integrated circuit chips, also known as FPGA modules, have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: These chips are based on Field-Programmable Gate Array (FPGA) technology, which allows for high-speed processing and parallel computing capabilities. 2. Flexibility: FPGA modules can be reprogrammed and reconfigured to perform different tasks, making them highly adaptable to changing requirements. 3. Customization: These chips can be programmed to implement custom logic functions, making them suitable for a wide range of applications. 4. Integration: FPGA modules often come with various peripherals and interfaces, allowing for easy integration with other components and systems. 5. Prototyping and Development: These chips are commonly used in prototyping and development stages of electronic systems, enabling rapid testing and iteration.Application Scenarios: 1. Digital Signal Processing (DSP): FPGA modules can be used for real-time signal processing tasks, such as audio and video processing, image recognition, and data compression. 2. Communication Systems: These chips are suitable for implementing communication protocols, such as Ethernet, USB, and wireless standards like Wi-Fi and Bluetooth. 3. Industrial Automation: FPGA modules can be used in industrial control systems, robotics, and automation applications, providing high-speed data processing and control capabilities. 4. Aerospace and Defense: These chips are used in radar systems, avionics, satellite communication, and other defense applications that require high-performance computing and reliability. 5. Internet of Things (IoT): FPGA modules can be integrated into IoT devices to handle data processing, sensor interfacing, and communication tasks. 6. High-Frequency Trading: These chips are used in financial systems that require low-latency and high-speed processing for algorithmic trading and market analysis.It's important to note that the specific advantages and application scenarios may vary depending on the exact features and capabilities of the TE0745-02-81C11-A integrated circuit chips.
TE0745-02-81C11-A Relevant information