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TE0803-02-04EV-1E3

TE0803-02-04EV-1E3

Manufacturer No:

TE0803-02-04EV-1E3

Manufacturer:

Trenz Electronic GmbH

Description:

IC MODULE ZYNQ USCALE 2GB 128MB

Datasheet:

Datasheet

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Payment:

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TE0803-02-04EV-1E3 Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Connector Type
    B2B
  • RAM Size
    2GB
  • Flash Size
    128MB
  • Speed
    -
  • Co-Processor
    -
  • Core Processor
    Zynq UltraScale+ XCZU4EV-1SFVC784E
  • Module/Board Type
    MPU Core
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    TE0803
The TE0803-02-04EV-1E3 is an integrated circuit chip developed by Trenz Electronic. It is specifically designed for high-performance applications and offers several advantages and application scenarios. Some of them include:1. High Performance: The TE0803-02-04EV-1E3 chip is built using advanced technology, allowing it to deliver high-performance computing capabilities. It is equipped with a powerful Xilinx Zynq UltraScale+ MPSoC, which combines a quad-core ARM Cortex-A53 processor with programmable logic resources.2. Programmability: The chip's programmable logic resources enable users to customize and adapt the functionality of the chip to their specific application requirements. This flexibility makes it suitable for a wide range of applications.3. Versatility: The TE0803-02-04EV-1E3 chip supports various interfaces, including high-speed serial transceivers, Ethernet, USB, and PCIe. This versatility allows it to be used in diverse applications such as industrial automation, robotics, medical devices, and high-speed data processing.4. Embedded Processing: With its ARM Cortex-A53 processor, the chip can handle complex processing tasks directly on the chip itself. This capability is particularly useful in applications that require real-time processing or low-latency operations.5. High-Speed Data Transfer: The chip's high-speed serial transceivers and PCIe interface enable fast data transfer rates, making it suitable for applications that require high-bandwidth communication, such as data acquisition systems, image processing, and networking equipment.6. Evaluation and Prototyping: The TE0803-02-04EV-1E3 chip is designed as an evaluation and prototyping platform, allowing developers to test and validate their designs before moving to production. It provides a convenient and cost-effective solution for developing and testing complex systems.Overall, the TE0803-02-04EV-1E3 integrated circuit chip offers high performance, versatility, and programmability, making it suitable for a wide range of applications that require advanced processing capabilities, high-speed data transfer, and customization options.
TE0803-02-04EV-1E3 Relevant information