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TE0820-03-2BE21FL

TE0820-03-2BE21FL

Manufacturer No:

TE0820-03-2BE21FL

Manufacturer:

Trenz Electronic GmbH

Description:

MOD MPSOC

Datasheet:

Datasheet

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TE0820-03-2BE21FL Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Connector Type
    Samtec LSHM
  • RAM Size
    2GB
  • Flash Size
    128MB
  • Speed
    -
  • Co-Processor
    -
  • Core Processor
    Zynq UltraScale+ XCZU2EG-1SFVC784E
  • Module/Board Type
    MPU Core
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    TE0820
The TE0820-03-2BE21FL is an integrated circuit chip from Trenz Electronic. It is a System-on-Module (SoM) based on the Xilinx Zynq UltraScale+ MPSoC. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The TE0820-03-2BE21FL chip is based on the powerful Xilinx Zynq UltraScale+ MPSoC, which combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor and programmable logic (FPGA). This allows for high-performance computing and real-time processing capabilities.2. Programmability: The integrated FPGA in the chip provides programmable logic, allowing users to implement custom hardware accelerators and interfaces. This flexibility enables the chip to be tailored to specific application requirements.3. Connectivity: The TE0820-03-2BE21FL chip offers a wide range of connectivity options, including Gigabit Ethernet, USB, PCIe, and various serial interfaces. This makes it suitable for applications that require high-speed data transfer and communication.4. Small Form Factor: The chip is designed as a System-on-Module, which means it is a compact and self-contained unit that can be easily integrated into larger systems. This makes it suitable for applications with space constraints.Application Scenarios: 1. Embedded Systems: The TE0820-03-2BE21FL chip is well-suited for embedded systems that require high-performance processing, real-time capabilities, and custom hardware acceleration. It can be used in applications such as industrial automation, robotics, and machine vision.2. Edge Computing: With its powerful processing capabilities and connectivity options, the chip can be used in edge computing applications. It can perform local data processing and analysis, reducing the need for data transmission to the cloud and enabling real-time decision-making.3. High-Speed Data Acquisition: The TE0820-03-2BE21FL chip's connectivity options, including PCIe and high-speed serial interfaces, make it suitable for applications that require high-speed data acquisition and processing, such as data logging, scientific instrumentation, and high-frequency trading.4. Communication Systems: The chip's networking capabilities, including Gigabit Ethernet and USB, make it suitable for communication systems that require high-speed data transfer and protocol handling. It can be used in applications such as network routers, gateways, and software-defined radios.Overall, the TE0820-03-2BE21FL chip offers high performance, programmability, and connectivity, making it suitable for a wide range of applications that require advanced processing capabilities and flexibility.
TE0820-03-2BE21FL Relevant information