TE0820-03-02EG-1EL

TE0820-03-02EG-1EL

Manufacturer No:

TE0820-03-02EG-1EL

Manufacturer:

Trenz Electronic GmbH

Description:

IC MODULE ZYNQ USCALE 2GB 128MB

Datasheet:

Datasheet

Delivery:

Payment:

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TE0820-03-02EG-1EL Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    1.570" L x 1.970" W (40.00mm x 50.00mm)
  • Connector Type
    B2B
  • RAM Size
    2GB
  • Flash Size
    128MB
  • Speed
    -
  • Co-Processor
    -
  • Core Processor
    Zynq UltraScale+ XCZU2EG-1SFVC784E
  • Module/Board Type
    MPU Core
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    TE0820
The TE0820-03-02EG-1EL integrated circuit chips, also known as System-on-Modules (SoMs), have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: These chips are designed to provide high computing power and performance, making them suitable for demanding applications. 2. Compact Size: The TE0820-03-02EG-1EL chips are small in size, allowing for easy integration into various devices and systems. 3. Low Power Consumption: These chips are designed to be energy-efficient, reducing power consumption and extending battery life in portable devices. 4. Scalability: The chips offer scalability, allowing for easy customization and expansion of functionalities based on specific application requirements. 5. Easy Integration: The TE0820-03-02EG-1EL chips come with various interfaces and connectivity options, making them easy to integrate into different systems.Application Scenarios: 1. Industrial Automation: These chips can be used in industrial automation systems for tasks such as machine control, data acquisition, and monitoring. 2. Robotics: The high computing power and compact size of these chips make them suitable for robotics applications, including autonomous robots and robotic control systems. 3. Medical Devices: The TE0820-03-02EG-1EL chips can be used in medical devices such as patient monitoring systems, diagnostic equipment, and medical imaging devices. 4. IoT (Internet of Things): These chips can be utilized in IoT devices and applications, enabling connectivity, data processing, and control in smart homes, industrial IoT, and other IoT solutions. 5. Embedded Systems: The chips are ideal for embedded systems, including embedded computers, edge computing devices, and embedded control systems in various industries.Overall, the TE0820-03-02EG-1EL integrated circuit chips offer high performance, compact size, low power consumption, scalability, and easy integration, making them suitable for a wide range of applications in industries such as industrial automation, robotics, medical devices, IoT, and embedded systems.