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TE0803-03-3BE11-A

TE0803-03-3BE11-A

Manufacturer No:

TE0803-03-3BE11-A

Manufacturer:

Trenz Electronic GmbH

Description:

IC MODULE ZYNQ USCALE 2GB 128MB

Datasheet:

Datasheet

Delivery:

Payment:

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TE0803-03-3BE11-A Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Connector Type
    B2B
  • RAM Size
    2GB
  • Flash Size
    128MB
  • Speed
    -
  • Co-Processor
    -
  • Core Processor
    Zynq UltraScale+ XCZU3EG-1SFVC784E
  • Module/Board Type
    MPU Core
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    TE0803
The TE0803-03-3BE11-A is a specific model of an integrated circuit chip, and without more information about its specific features and capabilities, it is difficult to provide a comprehensive list of advantages and application scenarios. However, here are some general advantages and potential application scenarios for integrated circuit chips:Advantages: 1. Miniaturization: Integrated circuit chips allow for the miniaturization of complex electronic circuits, enabling the development of smaller and more portable devices. 2. Power efficiency: Integrated circuits are designed to be power-efficient, helping to reduce energy consumption and extend battery life in electronic devices. 3. Cost-effectiveness: Mass production of integrated circuit chips can lead to cost savings due to economies of scale. 4. Reliability: Integrated circuits are typically more reliable than discrete electronic components, as they are less prone to physical damage and have fewer interconnections. 5. Performance: Integrated circuits can offer high-speed operation, low latency, and improved signal integrity compared to traditional circuit designs.Application Scenarios: 1. Consumer Electronics: Integrated circuit chips are widely used in consumer electronics such as smartphones, tablets, laptops, and smart home devices. 2. Automotive: Integrated circuits play a crucial role in automotive applications, including engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). 3. Industrial Automation: Integrated circuits are used in industrial automation systems for control, monitoring, and communication purposes. 4. Medical Devices: Integrated circuits are utilized in various medical devices, including diagnostic equipment, patient monitoring systems, and implantable devices. 5. Aerospace and Defense: Integrated circuits are essential in aerospace and defense applications, including avionics, radar systems, communication systems, and missile guidance systems.It is important to note that the specific advantages and application scenarios of the TE0803-03-3BE11-A chip may vary depending on its intended purpose and specifications.
TE0803-03-3BE11-A Relevant information