Home / Microcontrollers, Microprocessor, FPGA Modules / TE0803-02-02CG-1EA/
TE0803-02-02CG-1EA

TE0803-02-02CG-1EA

Manufacturer No:

TE0803-02-02CG-1EA

Manufacturer:

Trenz Electronic GmbH

Description:

IC MODULE ZYNQ USCALE 2GB 128MB

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

TE0803-02-02CG-1EA Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Connector Type
    B2B
  • RAM Size
    2GB
  • Flash Size
    128MB
  • Speed
    -
  • Co-Processor
    -
  • Core Processor
    Zynq UltraScale+ XCZU2CG-1SFVC784E
  • Module/Board Type
    MPU Core
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    TE0803
The TE0803-02-02CG-1EA is a specific model of an integrated circuit chip, which is a general term for a small electronic device that contains multiple interconnected electronic components. Without specific information about the features and capabilities of this particular chip, it is difficult to provide a comprehensive list of advantages and application scenarios. However, here are some general advantages and potential application scenarios for integrated circuit chips:Advantages: 1. Miniaturization: Integrated circuit chips allow for the miniaturization of electronic devices, making them smaller, lighter, and more portable. 2. Cost-effectiveness: Mass production of integrated circuit chips reduces manufacturing costs, making them more affordable for various applications. 3. Power efficiency: Integrated circuit chips can be designed to consume less power, making them suitable for battery-powered devices. 4. Reliability: Integrated circuit chips are less prone to failure due to their compact design and reduced number of interconnections. 5. Versatility: Integrated circuit chips can be designed to perform a wide range of functions, making them suitable for various applications.Application Scenarios: 1. Consumer Electronics: Integrated circuit chips are widely used in smartphones, tablets, laptops, televisions, and other consumer electronic devices. 2. Automotive: Integrated circuit chips are used in various automotive applications, including engine control units, infotainment systems, and advanced driver-assistance systems. 3. Industrial Automation: Integrated circuit chips are used in industrial control systems, robotics, and process automation. 4. Medical Devices: Integrated circuit chips are used in medical devices such as pacemakers, insulin pumps, and diagnostic equipment. 5. Internet of Things (IoT): Integrated circuit chips are used in IoT devices, enabling connectivity and data processing capabilities. 6. Aerospace and Defense: Integrated circuit chips are used in avionics systems, satellites, and military equipment.It is important to note that the specific advantages and application scenarios of the TE0803-02-02CG-1EA chip may vary depending on its features, specifications, and intended use.
TE0803-02-02CG-1EA Relevant information