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TE0820-03-02CG-1EA

TE0820-03-02CG-1EA

Manufacturer No:

TE0820-03-02CG-1EA

Manufacturer:

Trenz Electronic GmbH

Description:

IC MODULE ZYNQ USCALE 2GB 128MB

Datasheet:

Datasheet

Delivery:

Payment:

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TE0820-03-02CG-1EA Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Connector Type
    B2B
  • RAM Size
    2GB
  • Flash Size
    128MB
  • Speed
    -
  • Co-Processor
    -
  • Core Processor
    Zynq UltraScale+ XCZU2CG-1SFVC784E
  • Module/Board Type
    MPU Core
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    TE0820
The TE0820-03-02CG-1EA integrated circuit chips, also known as System-on-Modules (SoMs), have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: These chips are designed to provide high computing power and performance, making them suitable for demanding applications. 2. Compact Size: The TE0820-03-02CG-1EA chips are small in size, allowing for easy integration into various devices and systems. 3. Low Power Consumption: These chips are designed to be energy-efficient, making them suitable for battery-powered or low-power devices. 4. Scalability: The chips offer scalability options, allowing for customization and expansion based on specific application requirements. 5. Easy Integration: The TE0820-03-02CG-1EA chips come with various interfaces and connectivity options, making them easy to integrate into different systems.Application Scenarios: 1. Industrial Automation: These chips can be used in industrial automation systems for tasks such as control, monitoring, and data processing. 2. Robotics: The TE0820-03-02CG-1EA chips can be utilized in robotics applications, providing the necessary computing power for control and decision-making. 3. Medical Devices: These chips can be integrated into medical devices, such as diagnostic equipment or patient monitoring systems, to enable efficient data processing and analysis. 4. Internet of Things (IoT): The chips can be used in IoT devices, enabling connectivity, data processing, and communication with other devices or cloud services. 5. Embedded Systems: The TE0820-03-02CG-1EA chips are suitable for embedded systems, where compact size, low power consumption, and high performance are essential.It's important to note that the specific advantages and application scenarios may vary depending on the exact specifications and capabilities of the TE0820-03-02CG-1EA chips.
TE0820-03-02CG-1EA Relevant information