TE0820-02-03EG-1EA
Manufacturer No:
TE0820-02-03EG-1EA
Manufacturer:
Description:
IC MODULE ZYNQ USCALE 1GB 128MB
Datasheet:
Delivery:
Payment:
In Stock : 0
Please send RFQ , we will respond immediately.
TE0820-02-03EG-1EA Specifications
-
TypeParameter
-
Operating Temperature0°C ~ 85°C
-
Size / Dimension1.970" L x 1.570" W (50.00mm x 40.00mm)
-
Connector TypeB2B
-
RAM Size1GB
-
Flash Size128MB
-
Speed-
-
Co-Processor-
-
Core ProcessorZynq UltraScale+ XCZU3EG-1SFVC784E
-
Module/Board TypeMPU Core
-
PackagingBulk
-
Product StatusObsolete
-
SeriesTE0820
The TE0820-02-03EG-1EA is a specific model of integrated circuit (IC) chip, and without more information about its specific features and capabilities, it is difficult to provide a comprehensive list of advantages and application scenarios. However, here are some general advantages and potential application scenarios for IC chips:Advantages of IC chips: 1. Miniaturization: IC chips are small in size, allowing for compact and space-efficient designs. 2. Integration: They can integrate multiple functions or components into a single chip, reducing the need for external components and simplifying circuit design. 3. Power efficiency: IC chips are designed to be power-efficient, helping to reduce energy consumption. 4. Reliability: IC chips are manufactured using advanced processes, resulting in high reliability and long lifespan. 5. Cost-effectiveness: Mass production of IC chips leads to cost reductions, making them affordable for various applications.Application scenarios for IC chips: 1. Consumer electronics: IC chips are widely used in smartphones, tablets, laptops, televisions, and other consumer electronic devices. 2. Automotive industry: IC chips are used in various automotive applications, including engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). 3. Industrial automation: IC chips are employed in industrial control systems, robotics, and process automation. 4. Medical devices: IC chips are used in medical equipment such as patient monitors, imaging systems, and implantable devices. 5. Internet of Things (IoT): IC chips play a crucial role in IoT devices, enabling connectivity, data processing, and control in smart homes, wearables, and industrial IoT applications.It is important to note that the specific advantages and application scenarios of the TE0820-02-03EG-1EA chip may vary depending on its features, specifications, and intended use.
TE0820-02-03EG-1EA Relevant information
-
ME-AA1-480-1E2-D12E-R2
Enclustra FPGA Solutions -
ME-AA1-270-2I2-D11E-R2
Enclustra FPGA Solutions -
AA1-480-2I3-D12E-NFX3-R2
Enclustra FPGA Solutions -
ME-XU7-6EG-1I-D11E-R5.0
Enclustra FPGA Solutions -
ME-XU7-9EG-2I-D12E-R5.0
Enclustra FPGA Solutions -
ME-XU7-15EG-2I-D12E-R5.0
Enclustra FPGA Solutions -
ME-XU9-5EV-1I-D12E-L11-R3.0
Enclustra FPGA Solutions -
ME-XU9-4CG-1E-D11E-R3.0
Enclustra FPGA Solutions -
ME-XU9-7EV-2I-D12E-L11-R3.0
Enclustra FPGA Solutions -
ME-XU1-9EG-2I-D12E-R5.0
Enclustra FPGA Solutions