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TE0820-02-03CG-1EA

TE0820-02-03CG-1EA

Manufacturer No:

TE0820-02-03CG-1EA

Manufacturer:

Trenz Electronic GmbH

Description:

IC MODULE ZYNQ USCALE 1GB 128MB

Datasheet:

Datasheet

Delivery:

Payment:

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TE0820-02-03CG-1EA Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Connector Type
    B2B
  • RAM Size
    1GB
  • Flash Size
    128MB
  • Speed
    -
  • Co-Processor
    -
  • Core Processor
    Zynq UltraScale+ XCZU3CG-1SFVC784E
  • Module/Board Type
    MPU Core
  • Packaging
    Bulk
  • Product Status
    Discontinued at Digi-Key
  • Series
    TE0820
The TE0820-02-03CG-1EA integrated circuit chips, also known as System-on-Modules (SoMs), have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: These chips are designed to provide high computing power and performance, making them suitable for demanding applications. 2. Compact Size: The TE0820-02-03CG-1EA chips are small in size, allowing for easy integration into various devices and systems. 3. Low Power Consumption: These chips are designed to be energy-efficient, making them suitable for battery-powered or low-power devices. 4. Scalability: The chips offer scalability options, allowing for customization and expansion based on specific application requirements. 5. Easy Integration: The TE0820-02-03CG-1EA chips come with various interfaces and connectivity options, making them easy to integrate into different systems.Application Scenarios: 1. Industrial Automation: These chips can be used in industrial automation systems for tasks such as control, monitoring, and data processing. 2. Robotics: The high computing power and compact size of these chips make them suitable for robotics applications, including autonomous robots and robotic control systems. 3. Medical Devices: The TE0820-02-03CG-1EA chips can be used in medical devices such as portable diagnostic equipment, patient monitoring systems, and medical imaging devices. 4. IoT (Internet of Things): These chips can be utilized in IoT devices and edge computing applications, enabling data processing and connectivity in smart homes, smart cities, and industrial IoT deployments. 5. Embedded Systems: The chips can be integrated into various embedded systems, including digital signage, gaming consoles, multimedia devices, and automotive infotainment systems.It's important to note that the specific advantages and application scenarios may vary depending on the exact specifications and capabilities of the TE0820-02-03CG-1EA chips.
TE0820-02-03CG-1EA Relevant information