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TE0820-02-02CG-1EA

TE0820-02-02CG-1EA

Manufacturer No:

TE0820-02-02CG-1EA

Manufacturer:

Trenz Electronic GmbH

Description:

IC MODULE ZYNQ USCALE 1GB 128MB

Datasheet:

Datasheet

Delivery:

Payment:

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TE0820-02-02CG-1EA Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Connector Type
    B2B
  • RAM Size
    1GB
  • Flash Size
    128MB
  • Speed
    -
  • Co-Processor
    -
  • Core Processor
    Zynq UltraScale+ XCZU2CG-1SFVC784E
  • Module/Board Type
    MPU Core
  • Packaging
    Bulk
  • Product Status
    Discontinued at Digi-Key
  • Series
    TE0820
The TE0820-02-02CG-1EA integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with their powerful processing capabilities, making them suitable for demanding applications. 2. Versatility: They offer a wide range of features and functionalities, making them suitable for various applications across different industries. 3. Compact Size: The chips are compact in size, allowing for easy integration into different systems and devices. 4. Low Power Consumption: They are designed to consume low power, making them energy-efficient and suitable for battery-powered devices. 5. Scalability: These chips offer scalability options, allowing for easy customization and expansion of functionalities as per the application requirements. 6. Robustness: They are built to withstand harsh environmental conditions and offer reliable performance even in challenging situations.Application Scenarios: 1. Industrial Automation: These chips can be used in industrial automation systems for tasks such as control, monitoring, and data processing. 2. Robotics: They are suitable for robotics applications, providing the necessary processing power for complex algorithms and control systems. 3. Internet of Things (IoT): These chips can be used in IoT devices for data processing, connectivity, and edge computing. 4. Medical Devices: They can be utilized in medical devices for tasks such as signal processing, data analysis, and control. 5. Automotive: These chips can be integrated into automotive systems for tasks such as advanced driver assistance systems (ADAS), infotainment, and engine control. 6. Aerospace and Defense: They can be used in aerospace and defense applications for tasks such as navigation, communication, and surveillance.Overall, the TE0820-02-02CG-1EA integrated circuit chips offer high performance, versatility, and scalability, making them suitable for a wide range of applications across various industries.
TE0820-02-02CG-1EA Relevant information