TE0720-03-14S-1C

TE0720-03-14S-1C

Manufacturer No:

TE0720-03-14S-1C

Manufacturer:

Trenz Electronic GmbH

Description:

IC MOD CORTEX-A9 766MHZ 1GB 32MB

Datasheet:

Datasheet

Delivery:

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TE0720-03-14S-1C Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 70°C
  • Size / Dimension
    1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Connector Type
    Samtec LSHM
  • RAM Size
    1GB
  • Flash Size
    32MB
  • Speed
    766MHz
  • Co-Processor
    Zynq-7000 (Z-7014S)
  • Core Processor
    ARM Cortex-A9
  • Module/Board Type
    MCU, FPGA
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    TE0720
The TE0720-03-14S-1C is an integrated circuit chip developed by Trenz Electronic. It is a System-on-Module (SoM) based on the Xilinx Zynq-7000 All Programmable SoC, which combines a dual-core ARM Cortex-A9 processor with programmable logic.Advantages of the TE0720-03-14S-1C chip:1. High Performance: The dual-core ARM Cortex-A9 processor provides high processing power, making it suitable for applications that require intensive computation.2. Programmable Logic: The integrated programmable logic allows for customization and acceleration of specific tasks, enabling the chip to be used in a wide range of applications.3. Low Power Consumption: The TE0720-03-14S-1C chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications.4. Small Form Factor: The chip is compact and comes in a small form factor, making it suitable for applications with space constraints.Application scenarios of the TE0720-03-14S-1C chip:1. Embedded Systems: The chip can be used in various embedded systems, such as industrial automation, robotics, and IoT devices, where high-performance processing and programmable logic are required.2. Signal Processing: The TE0720-03-14S-1C chip can be used in applications that involve real-time signal processing, such as audio and video processing, image recognition, and software-defined radio.3. Prototyping and Development: The chip is commonly used in prototyping and development of complex systems, allowing engineers to quickly test and validate their designs before moving to production.4. High-Performance Computing: The TE0720-03-14S-1C chip can be used in applications that require high-performance computing, such as scientific research, data analysis, and simulation.5. Communication Systems: The chip can be used in communication systems, including wireless base stations, network routers, and gateways, where it can handle both the processing and communication tasks efficiently.Overall, the TE0720-03-14S-1C chip offers a combination of high-performance processing, programmable logic, and low power consumption, making it suitable for a wide range of applications in various industries.