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TE0720-03-2IFC3

TE0720-03-2IFC3

Manufacturer No:

TE0720-03-2IFC3

Manufacturer:

Trenz Electronic GmbH

Description:

IC MODULE CORTEX-A9 1GB 32MB

Datasheet:

Datasheet

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TE0720-03-2IFC3 Specifications

  • Type
    Parameter
  • Operating Temperature
    -40°C ~ 85°C
  • Size / Dimension
    1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Connector Type
    Samtec LSHM
  • RAM Size
    1GB
  • Flash Size
    32MB
  • Speed
    -
  • Co-Processor
    Zynq-7000 (Z-7020)
  • Core Processor
    ARM Cortex-A9
  • Module/Board Type
    MCU, FPGA
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    TE0720
The TE0720-03-2IFC3 is an integrated circuit chip developed by Trenz Electronic. It is a System-on-Module (SoM) based on the Xilinx Zynq-7000 All Programmable SoC, which combines a dual-core ARM Cortex-A9 processor with programmable logic.Advantages of the TE0720-03-2IFC3 chip:1. High Performance: The dual-core ARM Cortex-A9 processor provides high processing power, making it suitable for applications that require intensive computation.2. Programmable Logic: The integrated programmable logic allows for customization and acceleration of specific functions, enabling the chip to be tailored to different application requirements.3. Low Power Consumption: The TE0720-03-2IFC3 chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications.4. Small Form Factor: The chip is compact and comes in a small form factor, making it suitable for space-constrained applications.Application scenarios of the TE0720-03-2IFC3 chip:1. Embedded Systems: The chip can be used in various embedded systems, such as industrial automation, robotics, and IoT devices, where high-performance processing and programmable logic are required.2. Image and Video Processing: The TE0720-03-2IFC3 chip's processing power and programmable logic make it suitable for applications involving image and video processing, such as surveillance systems, video analytics, and digital signage.3. Communication Systems: The chip can be used in communication systems, including software-defined radios, network switches, and routers, where high-speed data processing and customization are essential.4. Medical Devices: The TE0720-03-2IFC3 chip can be utilized in medical devices, such as patient monitoring systems, medical imaging, and diagnostic equipment, where real-time processing and customization are crucial.5. Aerospace and Defense: The chip's high performance, low power consumption, and programmable logic make it suitable for aerospace and defense applications, including avionics, radar systems, and unmanned aerial vehicles (UAVs).Overall, the TE0720-03-2IFC3 chip offers a combination of processing power, programmability, and low power consumption, making it suitable for a wide range of applications requiring high-performance computing and customization.
TE0720-03-2IFC3 Relevant information